| 9698072 |
Low-stress dual underfill packaging |
Marie-Claude Paquet, Julien Sylvestre |
2017-07-04 |
|
| 9373559 |
Low-stress dual underfill packaging |
Marie-Claude Paquet, Julien Sylvestre |
2016-06-21 |
$3,815,000 |
| 8978960 |
Flip chip assembly apparatus employing a warpage-suppressor assembly |
Jae-Woong Nah, Katsuyuki Sakuma |
2015-03-17 |
$4,972,000 |
| 8910853 |
Additives for grain fragmentation in Pb-free Sn-based solder |
Charles L. Arvin, Alexandre Blander, Donald W. Henderson, Gareth G. Hougham, Hsichang Liu +7 more |
2014-12-16 |
$3,695,000 |
| 8870051 |
Flip chip assembly apparatus employing a warpage-suppressor assembly |
Jae-Woong Nah, Katsuyuki Sakuma |
2014-10-28 |
$3,762,000 |
| 8493746 |
Additives for grain fragmentation in Pb-free Sn-based solder |
Charles L. Arvin, Alexandre Blander, Donald W. Henderson, Gareth G. Hougham, Hsichang Liu +7 more |
2013-07-23 |
$2,085,000 |
| 7875502 |
Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners |
Jon A. Casey, Ian D. Melville, David L. Questad, Wolfgang Sauter, Thomas A. Wassick |
2011-01-25 |
$4,442,000 |
| 7732932 |
Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners |
Jon A. Casey, Ian D. Melville, David L. Questad, Wolfgang Sauter, Thomas A. Wassick |
2010-06-08 |
$3,517,000 |
| 7733655 |
Lid edge capping load |
Martin Beaumier, Mohamed Belazzouz, David L. Edwards, Kamal K. Sikka, Jiantao Zheng +1 more |
2010-06-08 |
$3,517,000 |
| 7709951 |
Thermal pillow |
William L. Brodsky, James A. Busby, Bruce J. Chamberlin, Scott Cummings, David L. Edwards +6 more |
2010-05-04 |
$4,679,000 |
| 6984792 |
Dielectric interposer for chip to substrate soldering |
Shaji Farooq, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter |
2006-01-10 |
$6,796,000 |
| 6878608 |
Method of manufacture of silicon based package |
Glenn G. Daves, Sudipta K. Ray, Herbert I. Stoller |
2005-04-12 |
$5,340,000 |
| 6657313 |
Dielectric interposer for chip to substrate soldering |
Shaji Faroon, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter |
2003-12-02 |
$4,756,000 |
| 6584684 |
Method for assembling a carrier and a semiconductor device |
Anson J. Call, Jeffrey T. Coffin, Kathleen A. Stalter |
2003-07-01 |
$13,647,000 |
| 6559527 |
Process for forming cone shaped solder for chip interconnection |
Shaji Farooq, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter |
2003-05-06 |
$19,022,000 |
| 6548909 |
Method of interconnecting electronic components using a plurality of conductive studs |
Sudipta K. Ray, Kathleen A. Stalter |
2003-04-15 |
$16,310,000 |
| 6283359 |
Method for enhancing fatigue life of ball grid arrays |
Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson, Gregory B. Martin +3 more |
2001-09-04 |
$27,475,000 |
| 6278184 |
Solder disc connection |
Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson, William E. Sablinski +3 more |
2001-08-21 |
$21,309,000 |
| 6270363 |
Z-axis compressible polymer with fine metal matrix suspension |
John U. Knickerbocker, Sudipta K. Ray, Kathleen A. Stalter |
2001-08-07 |
$22,988,000 |
| 6258625 |
Method of interconnecting electronic components using a plurality of conductive studs |
Sudipta K. Ray, Kathleen A. Stalter |
2001-07-10 |
$19,901,000 |
| 6253986 |
Solder disc connection |
Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson, William E. Sablinski +3 more |
2001-07-03 |
$26,086,000 |
| 6220499 |
Method for assembling a chip carrier to a semiconductor device |
Shaji Faroog, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter |
2001-04-24 |
$20,927,000 |
| 6218629 |
Module with metal-ion matrix induced dendrites for interconnection |
Anson J. Call, Jeffrey T. Coffin, Kathleen A. Stalter |
2001-04-17 |
$20,042,000 |
| 6184062 |
Process for forming cone shaped solder for chip interconnection |
Shaji Farooq, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter |
2001-02-06 |
$23,051,000 |
| 6158644 |
Method for enhancing fatigue life of ball grid arrays |
Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson, Gregory B. Martin +3 more |
2000-12-12 |
$56,886,000 |
