PB

Peter J. Brofman

IBM: 35 patents #2,774 of 70,183Top 4%
Overall (All Time): #98,875 of 4,157,543Top 3%
35
Patents All Time

Issued Patents All Time

Showing 25 most recent of 35 patents

Patent #TitleCo-InventorsDate
9698072 Low-stress dual underfill packaging Marie-Claude Paquet, Julien Sylvestre 2017-07-04
9373559 Low-stress dual underfill packaging Marie-Claude Paquet, Julien Sylvestre 2016-06-21
8978960 Flip chip assembly apparatus employing a warpage-suppressor assembly Jae-Woong Nah, Katsuyuki Sakuma 2015-03-17
8910853 Additives for grain fragmentation in Pb-free Sn-based solder Charles L. Arvin, Alexandre Blander, Donald W. Henderson, Gareth G. Hougham, Hsichang Liu +7 more 2014-12-16
8870051 Flip chip assembly apparatus employing a warpage-suppressor assembly Jae-Woong Nah, Katsuyuki Sakuma 2014-10-28
8493746 Additives for grain fragmentation in Pb-free Sn-based solder Charles L. Arvin, Alexandre Blander, Donald W. Henderson, Gareth G. Hougham, Hsichang Liu +7 more 2013-07-23
7875502 Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners Jon A. Casey, Ian D. Melville, David L. Questad, Wolfgang Sauter, Thomas A. Wassick 2011-01-25
7732932 Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners Jon A. Casey, Ian D. Melville, David L. Questad, Wolfgang Sauter, Thomas A. Wassick 2010-06-08
7733655 Lid edge capping load Martin Beaumier, Mohamed Belazzouz, David L. Edwards, Kamal K. Sikka, Jiantao Zheng +1 more 2010-06-08
7709951 Thermal pillow William L. Brodsky, James A. Busby, Bruce J. Chamberlin, Scott Cummings, David L. Edwards +6 more 2010-05-04
6984792 Dielectric interposer for chip to substrate soldering Shaji Farooq, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter 2006-01-10
6878608 Method of manufacture of silicon based package Glenn G. Daves, Sudipta K. Ray, Herbert I. Stoller 2005-04-12
6657313 Dielectric interposer for chip to substrate soldering Shaji Faroon, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter 2003-12-02
6584684 Method for assembling a carrier and a semiconductor device Anson J. Call, Jeffrey T. Coffin, Kathleen A. Stalter 2003-07-01
6559527 Process for forming cone shaped solder for chip interconnection Shaji Farooq, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter 2003-05-06
6548909 Method of interconnecting electronic components using a plurality of conductive studs Sudipta K. Ray, Kathleen A. Stalter 2003-04-15
6283359 Method for enhancing fatigue life of ball grid arrays Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson, Gregory B. Martin +3 more 2001-09-04
6278184 Solder disc connection Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson, William E. Sablinski +3 more 2001-08-21
6270363 Z-axis compressible polymer with fine metal matrix suspension John U. Knickerbocker, Sudipta K. Ray, Kathleen A. Stalter 2001-08-07
6258625 Method of interconnecting electronic components using a plurality of conductive studs Sudipta K. Ray, Kathleen A. Stalter 2001-07-10
6253986 Solder disc connection Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson, William E. Sablinski +3 more 2001-07-03
6220499 Method for assembling a chip carrier to a semiconductor device Shaji Faroog, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter 2001-04-24
6218629 Module with metal-ion matrix induced dendrites for interconnection Anson J. Call, Jeffrey T. Coffin, Kathleen A. Stalter 2001-04-17
6184062 Process for forming cone shaped solder for chip interconnection Shaji Farooq, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter 2001-02-06
6158644 Method for enhancing fatigue life of ball grid arrays Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson, Gregory B. Martin +3 more 2000-12-12