Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6070782 | Socketable bump grid array shaped-solder on copper spheres | Balaram Ghosal, Raymond A. Jackson, Kathleen A. Lidestri, Karl J. Puttlitz, William E. Sablinski | 2000-06-06 |
| 6070321 | Solder disc connection | Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson, William E. Sablinski +3 more | 2000-06-06 |
| 6016947 | Non-destructive low melt test for off-composition solder | Timothy W. Donahue, Ellyn M. Ingalls, Chon Cheong Lei, Wai Mon Ma, Horatio Quinones +1 more | 2000-01-25 |
| 5975409 | Ceramic ball grid array using in-situ solder stretch | Patrick A. Coico, Mark G. Courtney, Shaji Farooq, Lewis S. Goldmann, Raymond A. Jackson +5 more | 1999-11-02 |
| 5968670 | Enhanced ceramic ball grid array using in-situ solder stretch with spring | Patrick A. Coico, Mark G. Courtney, James H. Covell, Shaji Farooq, Lewis S. Goldmann +6 more | 1999-10-19 |
| 5964396 | Enhanced ceramic ball grid array using in-situ solder stretch with clip | Patrick A. Coico, Mark G. Courtney, Shaji Farooq, Lewis S. Goldmann, Raymond A. Jackson +5 more | 1999-10-12 |
| 5868304 | Socketable bump grid array shaped-solder on copper spheres | Balaram Ghosal, Raymond A. Jackson, Kathleen A. Lidestri, Karl J. Puttlitz, William E. Sablinski | 1999-02-09 |
| 5831810 | Electronic component package with decoupling capacitors completely within die receiving cavity of substrate | Kenneth A. Bird, Francis F. Cappo, Jason L. Frankel, Suresh D. Kadakia, Sarah H. Knickerbocker +1 more | 1998-11-03 |
| 5284286 | Porous metal block for removing solder or braze from a substate and a process for making the same | Shaji Farooq, Kathleen A. Lidestri, Gregg B. Monjeau, Karl J. Puttlitz | 1994-02-08 |
| 5219520 | Process of making a porous metal block for removing solder or braze | Shaji Farooq, Kathleen A. Lidestri, Gregg B. Monjeau, Karl J. Puttlitz | 1993-06-15 |