Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6964885 | Stress resistant land grid array (LGA) module and method of forming the same | Patrick A. Coico, James H. Covell, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering +4 more | 2005-11-15 |
| 6805974 | Lead-free tin-silver-copper alloy solder composition | Won Kook Choi, Charles C. Goldsmith, Timothy A. Gosselin, Donald W. Henderson, Sung Kwon Kang +1 more | 2004-10-19 |
| 6746770 | Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof | Ali Afzali-Ardakani, Marie Angelopoulos, Jack A. Dickerson, Thomas Baird Pillsbury, Jane M. Shaw +1 more | 2004-06-08 |
| 6703560 | Stress resistant land grid array (LGA) module and method of forming the same | Patrick A. Coico, James H. Covell, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering +4 more | 2004-03-09 |
| 6287126 | Mechanical attachment means used as electrical connection | Michael Berger, Lewis S. Goldmann, Harvey C. Hamel, Mario J. Interrante, Marlene W. Moyer +1 more | 2001-09-11 |
| 6212070 | Zero force heat sink | Eugene Atwood, Joseph A. Benenati, James J. Dankelman, Horatio Quinones, Eric J. Kastberg | 2001-04-03 |
| 6179196 | Apparatus for manufacturing circuit boards | Craig G. Heim, Russell H. Lewis, Mark V. Pierson | 2001-01-30 |
| 6070782 | Socketable bump grid array shaped-solder on copper spheres | Peter J. Brofman, Balaram Ghosal, Raymond A. Jackson, Kathleen A. Lidestri, William E. Sablinski | 2000-06-06 |
| 6068175 | System for replacing a first area array component connected to an interconnect board | Craig G. Heim, Russell H. Lewis, Mark V. Pierson | 2000-05-30 |
| 5868304 | Socketable bump grid array shaped-solder on copper spheres | Peter J. Brofman, Balaram Ghosal, Raymond A. Jackson, Kathleen A. Lidestri, William E. Sablinski | 1999-02-09 |
| 5862588 | Method for restraining circuit board warp during area array rework | Craig G. Heim, Russell H. Lewis, Mark V. Pierson | 1999-01-26 |
| 5805430 | Zero force heat sink | Eugene Atwood, Joseph A. Benenati, James J. Dankelman, Horatio Quinones, Eric J. Kastberg | 1998-09-08 |
| 5721299 | Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof | Marie Angelopoulos, Ali Afzali-Ardakani, Jack A. Dickerson, Thomas Baird Pillsbury, Jane M. Shaw +1 more | 1998-02-24 |
| 5620132 | Apparatus and method for removing meltable material from a substrate | Andrew J. Downing, Donald C. Foster | 1997-04-15 |
| 5458281 | Method for removing meltable material from a substrate | Andrew J. Downing, Donald C. Foster | 1995-10-17 |
| 5284286 | Porous metal block for removing solder or braze from a substate and a process for making the same | Peter J. Brofman, Shaji Farooq, Kathleen A. Lidestri, Gregg B. Monjeau | 1994-02-08 |
| 5251806 | Method of forming dual height solder interconnections | Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman +8 more | 1993-10-12 |
| 5219520 | Process of making a porous metal block for removing solder or braze | Peter J. Brofman, Shaji Farooq, Kathleen A. Lidestri, Gregg B. Monjeau | 1993-06-15 |
| 5130779 | Solder mass having conductive encapsulating arrangement | Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman +8 more | 1992-07-14 |
| 4604644 | Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making | Keith F. Beckham, Anne Elizabeth Kolman, Kathleen Mary McGuire, Horatio Quinones | 1986-08-05 |