Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8910853 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Gareth G. Hougham, Hsichang Liu +7 more | 2014-12-16 |
| 8493746 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Gareth G. Hougham, Hsichang Liu +7 more | 2013-07-23 |
| 8314500 | Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith +8 more | 2012-11-20 |
| 8157158 | Modification of solder alloy compositions to suppress interfacial void formation in solder joints | Peter A. Gruber, Sung Kwon Kang, Da-Yuan Shih | 2012-04-17 |
| 7932169 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith +8 more | 2011-04-26 |
| 7784669 | Method and process for reducing undercooling in a lead-free tin-rich solder alloy | Gareth G. Hougham, Kamalesh K. Srivastava, Sung Kwon Kang, Da-Yuan Shih, Brian R. Sundlof +4 more | 2010-08-31 |
| 7703661 | Method and process for reducing undercooling in a lead-free tin-rich solder alloy | Gareth G. Hougham, Kamalesh K. Srivastava, Sung Kwon Kang, Da-Yuan Shih, Brian R. Sundlof +4 more | 2010-04-27 |
| 7703199 | Method to accommodate increase in volume expansion during solder reflow | David V. Caletka, Krishna Darbha, Lawrence P. Lehman, George H. Thiel | 2010-04-27 |
| 7273803 | Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure | Yu-Ting Cheng, Stefanie Chiras, Sung Kwon Kang, Stephen Kilpatrick, Henry A. Nye, III +2 more | 2007-09-25 |
| 7086147 | Method of accommodating in volume expansion during solder reflow | David V. Caletka, Krishna Darbha, Lawrence P. Lehman, George H. Thiel | 2006-08-08 |
| 7079393 | Fluidic cooling systems and methods for electronic components | Evan G. Colgan, Frank L. Pompeo, Glenn G. Daves, Hilton T. Toy, Bruce K. Furman +7 more | 2006-07-18 |
| 6921015 | Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder | William E. Bernier, James Spalik, Isabelle Paquin | 2005-07-26 |
| 6805974 | Lead-free tin-silver-copper alloy solder composition | Won Kook Choi, Charles C. Goldsmith, Timothy A. Gosselin, Sung Kwon Kang, Karl J. Puttlitz +1 more | 2004-10-19 |
| 6686664 | Structure to accommodate increase in volume expansion during solder reflow | David V. Caletka, Krishna Darbha, Lawrence P. Lehman, George H. Thiel | 2004-02-03 |
| 6649833 | Negative volume expansion lead-free electrical connection | David V. Caletka, Krishna Darbha, Lawrence P. Lehman, George H. Thiel | 2003-11-18 |
| 6598505 | Punch actuator monitoring system and method | Edward F. Helinski | 2003-07-29 |
| 6585150 | Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder | William E. Bernier, James Spalik, Isabelle Paquin | 2003-07-01 |
| 6550667 | Flux composition and soldering method for high density arrays | William E. Bernier, James Spalik | 2003-04-22 |
| 6468363 | Composition for increasing activity of a no-clean flux | James Spalik | 2002-10-22 |
| 6305258 | Punch actuator monitoring system and method | Edward F. Helinski | 2001-10-23 |
| 6217671 | Composition for increasing activity of a no-clean flux | James Spalik | 2001-04-17 |
| 6190530 | Anode container, electroplating system, method and plated object | William L. Brodsky, Lawrence P. Lehman | 2001-02-20 |
| 6024266 | System and method for transporting and clamping flexible film structures | Edward F. Helinski, David E. Houser | 2000-02-15 |
| 5957360 | System and method for transporting and clamping flexible film structures | Edward F. Helinski, David E. Houser | 1999-09-28 |
| 5902495 | Method and apparatus for establishing a solder bond to a solder ball grid array | Edward Joseph Burke, Lawrence P. Lehman, Daniel Webster, deceased | 1999-05-11 |