Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9252704 | Voltage tunable oscillator using bilayer graphene and a lead zirconate titanate capacitor | Osama M. Nayfeh, James Wilson, Madam Dubey, Ronald G. Polcawich | 2016-02-02 |
| 8026613 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Paul A. Lauro, Henry A. Nye, III +2 more | 2011-09-27 |
| 7923849 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Paul A. Lauro, Henry A. Nye, III +2 more | 2011-04-12 |
| 7410833 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Paul A. Lauro, Henry A. Nye, III +2 more | 2008-08-12 |
| 7276296 | Immersion plating and plated structures | Emanuel I. Cooper, Charles C. Goldsmith, Carmen M. Mojica, Henry A. Nye, III | 2007-10-02 |
| 7273803 | Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure | Yu-Ting Cheng, Stefanie Chiras, Donald W. Henderson, Sung Kwon Kang, Henry A. Nye, III +2 more | 2007-09-25 |
| 7037559 | Immersion plating and plated structures | Emanuel I. Cooper, Charles C. Goldsmith, Carmen M. Mojica, Henry A. Nye, III | 2006-05-02 |
| 6900142 | Inhibition of tin oxide formation in lead free interconnect formation | Emanual I. Cooper, John M. Cotte, Lisa A. Fanti, David E. Eichstadt, Henry A. Nye, III +1 more | 2005-05-31 |
| 6893799 | Dual-solder flip-chip solder bump | David Danovitch | 2005-05-17 |