Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Stephen Kilpatrick — 9 Patents

IBM: 8 patents #13,181 of 70,183Top 20%
UAUS Army: 1 patents #2,854 of 6,974Top 45%
Olney, MD: #32 of 207 inventorsTop 20%
Maryland: #3,598 of 35,612 inventorsTop 15%
Overall (All Time): #535,341 of 4,157,543Top 15%
9 Patents All Time
Stephen Kilpatrick has been granted 9 US patents while listed as an inventor at IBM. The first was granted in 2005 and the most recent in February 2016. Stephen Kilpatrick ranks #535,341 of 4,157,543 US inventors in our database (top 12.9%). Patent records list Stephen Kilpatrick in Olney, MD, US.

Patents per Year

Patents granted per year, 2005 to 2016Bar chart with a peak of 2 patents in 2005.peak 22005: 2 patents20052006: 1 patents20062007: 2 patents20072008: 1 patents20082011: 2 patents20112016: 1 patents2016

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
9252704 Voltage tunable oscillator using bilayer graphene and a lead zirconate titanate capacitor Osama M. Nayfeh, James Wilson, Madam Dubey, Ronald G. Polcawich 2016-02-02
8026613 Interconnections for flip-chip using lead-free solders and having reaction barrier layers Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Paul A. Lauro, Henry A. Nye, III +2 more 2011-09-27 $6,526,000
7923849 Interconnections for flip-chip using lead-free solders and having reaction barrier layers Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Paul A. Lauro, Henry A. Nye, III +2 more 2011-04-12 $5,593,000
7410833 Interconnections for flip-chip using lead-free solders and having reaction barrier layers Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Paul A. Lauro, Henry A. Nye, III +2 more 2008-08-12 $8,244,000
7276296 Immersion plating and plated structures Emanuel I. Cooper, Charles C. Goldsmith, Carmen M. Mojica, Henry A. Nye, III 2007-10-02 $8,802,000
7273803 Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure Yu-Ting Cheng, Stefanie Chiras, Donald W. Henderson, Sung Kwon Kang, Henry A. Nye, III +2 more 2007-09-25 $7,894,000
7037559 Immersion plating and plated structures Emanuel I. Cooper, Charles C. Goldsmith, Carmen M. Mojica, Henry A. Nye, III 2006-05-02 $4,743,000
6900142 Inhibition of tin oxide formation in lead free interconnect formation Emanual I. Cooper, John M. Cotte, Lisa A. Fanti, David E. Eichstadt, Henry A. Nye, III +1 more 2005-05-31 $8,494,000
6893799 Dual-solder flip-chip solder bump David Danovitch 2005-05-17 $7,073,000