Issued Patents All Time
Showing 25 most recent of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12324361 | Electrical connections between dissimilar materials at cryogenic temperatures | David W. Abraham, Nicholas A. Masluk | 2025-06-03 |
| 12249748 | Edge capacitive coupling for quantum chips | Muir Kumph, Oliver Dial, David W. Abraham | 2025-03-11 |
| 12150390 | Downstop and bump bonds formation on substrates | David W. Abraham | 2024-11-19 |
| 12033981 | Create a protected layer for interconnects and devices in a packaged quantum structure | David W. Abraham, Oliver Dial, Kevin S. Petrarca | 2024-07-09 |
| 11908756 | Interposer chips and enclosures for quantum circuits | David W. Abraham | 2024-02-20 |
| 11804442 | Combined backing plate and housing for use in bump bonded chip assembly | David W. Abraham, Shawn A. Hall | 2023-10-31 |
| 11676903 | Combined backing plate and housing for use in bump bonded chip assembly | David W. Abraham, Shawn A. Hall | 2023-06-13 |
| 11380974 | Superconducting airbridge crossover using superconducting sacrificial material | Josephine B. Chang | 2022-07-05 |
| 11111136 | Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact MEMS switch devices | Nils D. Hoivik, Christopher V. Jahnes | 2021-09-07 |
| 10833016 | Semiconductor device including superconducting metal through-silicon-vias and method of making the same | David W. Abraham | 2020-11-10 |
| 10734567 | Bump bonded cryogenic chip carrier | David W. Abraham, Mary B. Rothwell | 2020-08-04 |
| 10727391 | Bump bonded cryogenic chip carrier | David W. Abraham, Mary B. Rothwell | 2020-07-28 |
| 10727192 | Multiple sized bump bonds | David W. Abraham | 2020-07-28 |
| 10651099 | Non-destructive testing of integrated circuit chips | David W. Abraham | 2020-05-12 |
| 10629797 | Two-component bump metallization | David W. Abraham, Eric P. Lewandowski | 2020-04-21 |
| 10608158 | Two-component bump metallization | David W. Abraham, Eric P. Lewandowski | 2020-03-31 |
| 10504842 | Semiconductor device including superconducting metal through-silicon-vias | David W. Abraham | 2019-12-10 |
| 10347600 | Through-substrate-vias with self-aligned solder bumps | David W. Abraham | 2019-07-09 |
| 10325870 | Through-substrate-vias with self-aligned solder bumps | David W. Abraham | 2019-06-18 |
| 10308506 | Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact mems switch devices | Nils D. Hoivik, Christopher V. Jahnes | 2019-06-04 |
| 10199516 | Method for fabricating a photovoltaic device by uniform plating on dielectric passivated through-wafer vias and interconnects | Brett C. Baker-O'Neal, Shu-Yun Chong, Ronald D. Goldblatt, Jeffrey Hedrick, Qiang Huang +4 more | 2019-02-05 |
| 10170817 | Superconducting airbridge crossover using superconducting sacrificial material | Josephine B. Chang | 2019-01-01 |
| 10157842 | Semiconductor device including superconducting metal through-silicon-vias and method of manufacturing the same | David W. Abraham | 2018-12-18 |
| 9716192 | Method for fabricating a photovoltaic device by uniform plating on emitter-lined through-wafer vias and interconnects | Brett C. Baker-O'Neal, Shu-Yun Chong, Ronald D. Goldblatt, Jeffrey Hedrick, Qiang Huang +4 more | 2017-07-25 |
| 9614270 | Superconducting airbridge crossover using superconducting sacrificial material | Josephine B. Chang | 2017-04-04 |