John M. Cotte — 109 Patents at IBM

John M. Cotte has been granted 109 US patents while listed as an inventor at IBM. The first was granted in 1998 and the most recent in June 2025. John M. Cotte ranks #12,191 of 4,157,543 US inventors in our database (top 0.29%). Patent records list John M. Cotte in New Fairfield, CT, US.

Issued Patents All Time

Showing 1–25 of 109 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12324361	Electrical connections between dissimilar materials at cryogenic temperatures	David W. Abraham, Nicholas A. Masluk	2025-06-03
12249748	Edge capacitive coupling for quantum chips	Muir Kumph, Oliver Dial, David W. Abraham	2025-03-11
12150390	Downstop and bump bonds formation on substrates	David W. Abraham	2024-11-19	$17,641,000
12033981	Create a protected layer for interconnects and devices in a packaged quantum structure	David W. Abraham, Oliver Dial, Kevin S. Petrarca	2024-07-09	$16,648,000
11908756	Interposer chips and enclosures for quantum circuits	David W. Abraham	2024-02-20	$7,691,000
11804442	Combined backing plate and housing for use in bump bonded chip assembly	David W. Abraham, Shawn A. Hall	2023-10-31	$8,788,000
11676903	Combined backing plate and housing for use in bump bonded chip assembly	David W. Abraham, Shawn A. Hall	2023-06-13	$5,486,000
11380974	Superconducting airbridge crossover using superconducting sacrificial material	Josephine B. Chang	2022-07-05	$7,280,000
11111136	Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact MEMS switch devices	Nils D. Hoivik, Christopher V. Jahnes	2021-09-07	$7,685,000
10833016	Semiconductor device including superconducting metal through-silicon-vias and method of making the same	David W. Abraham	2020-11-10	$848,000
10734567	Bump bonded cryogenic chip carrier	David W. Abraham, Mary B. Rothwell	2020-08-04	$3,150,000
10727391	Bump bonded cryogenic chip carrier	David W. Abraham, Mary B. Rothwell	2020-07-28	$3,400,000
10727192	Multiple sized bump bonds	David W. Abraham	2020-07-28	$3,400,000
10651099	Non-destructive testing of integrated circuit chips	David W. Abraham	2020-05-12	$2,725,000
10629797	Two-component bump metallization	David W. Abraham, Eric P. Lewandowski	2020-04-21	$2,793,000
10608158	Two-component bump metallization	David W. Abraham, Eric P. Lewandowski	2020-03-31	$1,667,000
10504842	Semiconductor device including superconducting metal through-silicon-vias	David W. Abraham	2019-12-10	$5,388,000
10347600	Through-substrate-vias with self-aligned solder bumps	David W. Abraham	2019-07-09	$2,201,000
10325870	Through-substrate-vias with self-aligned solder bumps	David W. Abraham	2019-06-18	$3,033,000
10308506	Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact mems switch devices	Nils D. Hoivik, Christopher V. Jahnes	2019-06-04	$2,774,000
10199516	Method for fabricating a photovoltaic device by uniform plating on dielectric passivated through-wafer vias and interconnects	Brett C. Baker-O'Neal, Shu-Yun Chong, Ronald D. Goldblatt, Jeffrey Hedrick, Qiang Huang +4 more	2019-02-05	$9,200,000
10170817	Superconducting airbridge crossover using superconducting sacrificial material	Josephine B. Chang	2019-01-01
10157842	Semiconductor device including superconducting metal through-silicon-vias and method of manufacturing the same	David W. Abraham	2018-12-18	$3,830,000
9716192	Method for fabricating a photovoltaic device by uniform plating on emitter-lined through-wafer vias and interconnects	Brett C. Baker-O'Neal, Shu-Yun Chong, Ronald D. Goldblatt, Jeffrey Hedrick, Qiang Huang +4 more	2017-07-25	$2,827,000
9614270	Superconducting airbridge crossover using superconducting sacrificial material	Josephine B. Chang	2017-04-04	$2,713,000

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John M. Cotte — 109 Patents

Issued Patents All Time

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