Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Combined backing plate and housing for use in bump bonded chip assembly

Combined backing plate and housing for use in bump bonded chip assembly

US Patent 11676903 · Granted Jun 13, 2023

Estimated economic value: $5,486,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electrical connections between dissimilar materials at cryogenic temperatures2025
Electrical connections between dissimilar materials at cryogenic temperatures2025
Edge capacitive coupling for quantum chips2025
Edge capacitive coupling for quantum chips2025
Downstop and bump bonds formation on substrates2024
Downstop and bump bonds formation on substrates2024
Create a protected layer for interconnects and devices in a packaged quantum str2024
Create a protected layer for interconnects and devices in a packaged quantum str2024
Interposer chips and enclosures for quantum circuits2024
Interposer chips and enclosures for quantum circuits2024
Combined backing plate and housing for use in bump bonded chip assembly2023
Combined backing plate and housing for use in bump bonded chip assembly2023