Issued Patents All Time
Showing 1–25 of 120 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406930 | Structure containing a via-to-buried power rail contact structure or a via-to-backside power rail contact structure | Ruilong Xie, Stuart A. Sieg, Eric R. Miller | 2025-09-02 |
| 12178142 | Layered substrate structures with aligned optical access to electrical devices | Stephen M. Gates, Russell A. Budd, Vivekananda P. Adiga, Douglas M. Gill | 2024-12-24 |
| 12033981 | Create a protected layer for interconnects and devices in a packaged quantum structure | David W. Abraham, Oliver Dial, John M. Cotte | 2024-07-09 |
| 10784200 | Ionizing radiation blocking in IC chip to reduce soft errors | Mukta G. Farooq, Ian D. Melville, Kenneth P. Rodbell | 2020-09-22 |
| 10079175 | Insulating a via in a semiconductor substrate | Mukta G. Farooq, Jennifer A. Oakley, Nicole R. Reardon, Andrew H. Simon | 2018-09-18 |
| 9824925 | Flip chip alignment mark exposing method enabling wafer level underfill | Mukta G. Farooq, Nicholas A. Polomoff, Katsuyuki Sakuma | 2017-11-21 |
| 9728450 | Insulating a via in a semiconductor substrate | Mukta G. Farooq, Jennifer A. Oakley, Nicole R. Reardon, Andrew H. Simon | 2017-08-08 |
| 9673095 | Protected through semiconductor via (TSV) | Mukta G. Farooq, Jennifer A. Oakley, Richard P. Volant | 2017-06-06 |
| 9511918 | Self-locking container | Ira L. Allen, Lawrence A. Clevenger, Carl Radens | 2016-12-06 |
| 9401323 | Protected through semiconductor via (TSV) | Mukta G. Farooq, Jennifer A. Oakley, Richard P. Volant | 2016-07-26 |
| 9293375 | Selectively grown self-aligned fins for deep isolation integration | Stuart A. Sieg, Theodorus E. Standaert | 2016-03-22 |
| 9093503 | Semiconductor chip with a dual damascene wire and through-substrate via (TSV) structure | Fen Chen, Mukta G. Farooq, Jeffrey P. Gambino, Zhong-Xiang He, Anthony K. Stamper | 2015-07-28 |
| 9040418 | Enhanced capture pads for through semiconductor vias | Mukta G. Farooq, John A. Griesemer, Gary LaFontant, Richard P. Volant | 2015-05-26 |
| 9030295 | RFID tag with environmental sensor | Ira L. Allen, Lawrence A. Clevenger, Carl Radens | 2015-05-12 |
| 8999764 | Ionizing radiation blocking in IC chip to reduce soft errors | Mukta G. Farooq, Ian D. Melville, Kenneth P. Rodbell | 2015-04-07 |
| 8822141 | Front side wafer ID processing | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Stuart A. Sieg | 2014-09-02 |
| 8815475 | Reticle carrier | Donald F. Canaperi, Mahadevaiyer Krishnan, Rebecca D. Mih, Steven E. Steen, Henry Grabarz +1 more | 2014-08-26 |
| 8802990 | Self-aligned nano-scale device with parallel plate electrodes | Lawrence A. Clevenger, Zhengwen Li, Roger A. Quon, Carl Radens, Brian C. Sapp | 2014-08-12 |
| 8792080 | Method and system to predict lithography focus error using simulated or measured topography | Brian C. Sapp, Choongyeun Cho, Lawrence A. Clevenger, Laertis Economikos, Bernhard R. Liegl +1 more | 2014-07-29 |
| 8772949 | Enhanced capture pads for through semiconductor vias | Mukta G. Farooq, John A. Griesemer, Gary LaFontant, Richard P. Volant | 2014-07-08 |
| 8692649 | Asset management infrastructure | Lawrence A. Clevenger, Rainer Krause, Carl Radens, Brian C. Sapp | 2014-04-08 |
| 8691691 | TSV pillar as an interconnecting structure | Mukta G. Farooq, Troy L. Graves-Abe, William Francis Landers, Richard P. Volant | 2014-04-08 |
| 8665575 | Solar module with overheat protection | Lawrence A. Clevenger, Harold J. Hovel, Rainer Krause, Zhengwen Li, Gerd Pfeiffer +3 more | 2014-03-04 |
| 8633580 | Integrated void fill for through silicon via | Richard P. Volant, Mukta G. Farooq | 2014-01-21 |
| 8614115 | Photovoltaic solar cell device manufacture | Lawrence A. Clevenger, Harold J. Hovel, Rainer Krause, Gerd Pfeiffer, Kevin M. Prettyman +2 more | 2013-12-24 |