| 12406930 |
Structure containing a via-to-buried power rail contact structure or a via-to-backside power rail contact structure |
Ruilong Xie, Stuart A. Sieg, Kevin S. Petrarca |
2025-09-02 |
|
| 12402403 |
Air gap spacer for metal gates |
Marc A. Bergendahl, Kangguo Cheng, Fee Li Lie, John R. Sporre, Sean Teehan |
2025-08-26 |
|
| 12349475 |
Integrated circuit having vertical routing to bond pads |
Christian Boemler, Justin Gordon Adams Wehner, Drew Fairbanks, Sean P. Kilcoyne |
2025-07-01 |
|
| 12341099 |
Semiconductor backside transistor integration with backside power delivery network |
Ruilong Xie, Daniel C. Edelstein, Rajiv V. Joshi, Ravikumar Ramachandran |
2025-06-24 |
|
| 12327798 |
Physical unclonable function |
Kangguo Cheng, Fee Li Lie, Gauri Karve, Marc A. Bergendahl, John R. Sporre |
2025-06-10 |
|
| 12305310 |
Indium electroplating on physical vapor deposition tantalum |
Michael J. Rondon, Jon Sigurdson |
2025-05-20 |
|
| 12261186 |
Mosaic focal plane array |
David J. Gulbransen, Sean P. Kilcoyne, Matthew D. Chambers, Eric J. Beuville, Andrew E. Gin +1 more |
2025-03-25 |
|
| 12166110 |
Nanosheet channel-to-source and drain isolation |
Marc A. Bergendahl, Kangguo Cheng, Fee Li Lie, John R. Sporre, Sean Teehan |
2024-12-10 |
|
| 12148721 |
Iterative formation of damascene interconnects |
Sean P. Kilcoyne, Michael V. Liguori, Michael J. Rondon |
2024-11-19 |
|
| 12107132 |
Source/drain contact positioning under power rail |
Ruilong Xie, Indira Seshadri, Kangguo Cheng |
2024-10-01 |
$16,240,000 |
| 12080559 |
Using a same mask for direct print and self-aligned double patterning of nanosheets |
Stuart A. Sieg, Daniel James Dechene |
2024-09-03 |
$28,105,000 |
| 12021135 |
Bottom source/drain etch with fin-cut-last-VTFET |
Tao Li, Indira Seshadri, Nelson Felix |
2024-06-25 |
$10,690,000 |
| 12002805 |
Local vertical interconnects for monolithic stack transistors |
Heng Wu, Ruilong Xie, Chen Zhang |
2024-06-04 |
$14,788,000 |
| 11973125 |
Self-aligned uniform bottom spacers for VTFETS |
Ruilong Xie, Hemanth Jagannathan, Jay William Strane |
2024-04-30 |
$14,003,000 |
| 11916013 |
Via interconnects including super vias |
Yann Mignot, Christopher J. Waskiewicz, Chanro Park |
2024-02-27 |
$9,833,000 |
| 11869937 |
Semiconductor device and method of forming the semiconductor device |
Marc A. Bergendahl, Gauri Karve, Fee Li Lie, Robert R. Robison, John R. Sporre +1 more |
2024-01-09 |
$9,963,000 |
| 11869936 |
Semiconductor device and method of forming the semiconductor device |
Marc A. Bergendahl, Gauri Karve, Fee Li Lie, Robert R. Robison, John R. Sporre +1 more |
2024-01-09 |
$9,963,000 |
| 11837623 |
Integrated circuit having vertical routing to bond pads |
Christian Boemler, Justin Gordon Adams Wehner, Drew Fairbanks, Sean P. Kilcoyne |
2023-12-05 |
|
| 11791398 |
Nano multilayer carbon-rich low-k spacer |
Donald F. Canaperi, Richard A. Conti, Thomas J. Haigh, Jr., Son V. Nguyen |
2023-10-17 |
$7,011,000 |
| 11753736 |
Indium electroplating on physical vapor deposition tantalum |
Michael J. Rondon, Jon Sigurdson |
2023-09-12 |
|
| 11710768 |
Hybrid diffusion break with EUV gate patterning |
Indira Seshadri, Andrew M. Greene, Julien Frougier, Veeraraghavan S. Basker |
2023-07-25 |
$11,323,000 |
| 11710756 |
Integrating optical elements with electro-optical sensors via direct-bond hybridization |
Jamal I. Mustafa, Robert C. Anderson, John L. Vampola, Sean P. Kilcoyne, George Grama |
2023-07-25 |
|
| 11695059 |
Bottom source/drain etch with fin-cut-last-VTFET |
Tao Li, Indira Seshadri, Nelson Felix |
2023-07-04 |
|
| 11673766 |
Elevator analytics facilitating passenger destination prediction and resource optimization |
Gauri Karve, Tara Astigarraga, Kangguo Cheng, Fee Li Lie, Sean Teehan +1 more |
2023-06-13 |
$5,486,000 |
| 11652161 |
Nanosheet channel-to-source and drain isolation |
Marc A. Bergendahl, Kangguo Cheng, Fee Li Lie, John R. Sporre, Sean Teehan |
2023-05-16 |
$9,959,000 |
