IS

Indira Seshadri

IBM: 44 patents #2,042 of 70,183Top 3%
ET Elpis Technologies: 1 patents #31 of 121Top 30%
Overall (All Time): #64,316 of 4,157,543Top 2%
45
Patents All Time

Issued Patents All Time

Showing 25 most recent of 45 patents

Patent #TitleCo-InventorsDate
12374615 Electronic devices with a low dielectric constant Hsueh-Chung Chen, Su Chen Fan, Dechao Guo, Carl Radens 2025-07-29
12310100 Dielectric reflow for boundary control Jing Guo, Ekmini Anuja De Silva, Nicolas Loubet, Ruqiang Bao, Nelson Felix 2025-05-20
12268026 High aspect ratio contact structure with multiple metal stacks Junli Wang, Brent A. Anderson, Terence B. Hook, Albert M. Young, Stuart A. Sieg +2 more 2025-04-01
12107132 Source/drain contact positioning under power rail Ruilong Xie, Eric R. Miller, Kangguo Cheng 2024-10-01
12021135 Bottom source/drain etch with fin-cut-last-VTFET Tao Li, Nelson Felix, Eric R. Miller 2024-06-25
12002856 Vertical field effect transistor with crosslink fin arrangement Ruilong Xie, Chen Zhang, Ekmini Anuja De Silva 2024-06-04
11916143 Vertical transport field-effect transistor with gate patterning Ruilong Xie, Wenyu Xu, Jing Guo, Ekmini Anuja De Silva 2024-02-27
11855191 Vertical FET with contact to gate above active fin Brent A. Anderson, Junli Wang, Chen Zhang, Ruilong Xie, Joshua M. Rubin +1 more 2023-12-26
11810828 Transistor boundary protection using reversible crosslinking reflow Jing Guo, Ekmini Anuja De Silva, Jingyun Zhang, Su Chen Fan 2023-11-07
11756961 Staggered stacked vertical crystalline semiconducting channels Tsung-Sheng Kang, Tao Li, Ardasheir Rahman, Praveen Joseph, Ekmini Anuja De Silva 2023-09-12
11742426 Forming crossbar and non-crossbar transistors on the same substrate Ardasheir Rahman, Ruilong Xie, Hemanth Jagannathan 2023-08-29
11710768 Hybrid diffusion break with EUV gate patterning Eric R. Miller, Andrew M. Greene, Julien Frougier, Veeraraghavan S. Basker 2023-07-25
11695059 Bottom source/drain etch with fin-cut-last-VTFET Tao Li, Nelson Felix, Eric R. Miller 2023-07-04
11621326 Vertical field effect transistor with crosslink fin arrangement Ruilong Xie, Chen Zhang, Ekmini Anuja De Silva 2023-04-04
11569132 Transistor structure with N/P boundary buffer Romain Lallement, Ruqiang Bao 2023-01-31
11515431 Enabling residue free gap fill between nanosheets Ekmini Anuja De Silva, Jing Guo, Ruqiang Bao, Muthumanickam Sankarapandian, Nelson Felix 2022-11-29
11500293 Patterning material film stack with hard mask layer configured to support selective deposition on patterned resist layer Ekmini Anuja De Silva, Jing Guo, Ashim Dutta, Nelson Felix 2022-11-15
11276767 Additive core subtractive liner for metal cut etch processes Ruqiang Bao, Kisup Chung, Andrew M. Greene, Sivananda K. Kanakasabapathy, David L. Rath +1 more 2022-03-15
11251182 Staggered stacked vertical crystalline semiconducting channels Tsung-Sheng Kang, Tao Li, Ardasheir Rahman, Praveen Joseph, Ekmini Anuja De Silva 2022-02-15
11245027 Bottom source/drain etch with fin-cut-last-VTFET Tao Li, Nelson Felix, Eric R. Miller 2022-02-08
11152489 Additive core subtractive liner for metal cut etch processes Ruqiang Bao, Kisup Chung, Andrew M. Greene, Sivananda K. Kanakasabapathy, David L. Rath +1 more 2021-10-19
11075281 Additive core subtractive liner for metal cut etch processes Ruqiang Bao, Kisup Chung, Andrew M. Greene, Sivananda K. Kanakasabapathy, David L. Rath +1 more 2021-07-27
11075081 Semiconductor device with multiple threshold voltages Praveen Joseph, Ekmini Anuja De Silva 2021-07-27
11043494 Structure and method for equal substrate to channel height between N and P fin-FETs Lawrence A. Clevenger, Leigh Anne H. Clevenger, Mona A. Ebrish, Gauri Karve, Fee Li Lie +2 more 2021-06-22
10985025 Fin cut profile using fin base liner Eric R. Miller, Stuart A. Sieg, Yann Mignot, Christopher J. Waskiewicz 2021-04-20