Issued Patents All Time
Showing 25 most recent of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12048254 | Sacrificial material facilitating protection of a substrate in a qubit device | Vivekananda P. Adiga, Martin O. Sandberg, Jeng-Bang Yau, John Bruley, Cihan Kurter +2 more | 2024-07-23 |
| 11857997 | Metal surface protection | Ali Afzali-Ardakani, Sarunya Bangsaruntip, George G. Totir | 2024-01-02 |
| 11575077 | Microfabricated air bridges for quantum circuits | Vivekananda P. Adiga, Hongwen Yan, John M. Papalia, Jyotica V. Patel | 2023-02-07 |
| 11316154 | High throughput insulation of 3D in-silicon high volumetric energy and power dense energy storage devices | John Collins, John M. Papalia, Devendra K. Sadana | 2022-04-26 |
| 11276767 | Additive core subtractive liner for metal cut etch processes | Ruqiang Bao, Kisup Chung, Andrew M. Greene, Sivananda K. Kanakasabapathy, Indira Seshadri +1 more | 2022-03-15 |
| 11152489 | Additive core subtractive liner for metal cut etch processes | Ruqiang Bao, Kisup Chung, Andrew M. Greene, Sivananda K. Kanakasabapathy, Indira Seshadri +1 more | 2021-10-19 |
| 11094873 | Transmon qubits with self defined junctions | Vivekananda P. Adiga, Martin O. Sandberg | 2021-08-17 |
| 11075281 | Additive core subtractive liner for metal cut etch processes | Ruqiang Bao, Kisup Chung, Andrew M. Greene, Sivananda K. Kanakasabapathy, Indira Seshadri +1 more | 2021-07-27 |
| 11024512 | Selective etch formulation for silicon oxide | Ali Afzali-Ardakani, Benjamin Wymore, George G. Totir | 2021-06-01 |
| 10672707 | Low aspect ratio interconnect | Benjamin D. Briggs, Elbert E. Huang, Raghuveer R. Patlolla, Cornelius Brown Peethala, Chih-Chao Yang | 2020-06-02 |
| 10607933 | Interconnect structures with fully aligned vias | Daniel C. Edelstein, Nicholas C. M. Fuller, Elbert E. Huang, Satyanarayana V. Nitta | 2020-03-31 |
| 10600884 | Additive core subtractive liner for metal cut etch processes | Ruqiang Bao, Kisup Chung, Andrew M. Greene, Sivananda K. Kanakasabapathy, Indira Seshadri +1 more | 2020-03-24 |
| 10242909 | Wet etch removal of Ru selective to other metals | Benjamin D. Briggs, Cornelius Brown Peethala | 2019-03-26 |
| 10211153 | Low aspect ratio interconnect | Benjamin D. Briggs, Elbert E. Huang, Raghuveer R. Patlolla, Cornelius Brown Peethala, Chih-Chao Yang | 2019-02-19 |
| 10204856 | Interconnect structures with fully aligned vias | Daniel C. Edelstein, Nicholas C. M. Fuller, Elbert E. Huang, Satyanarayana V. Nitta | 2019-02-12 |
| 10170644 | Processes for uniform metal semiconductor alloy formation for front side contact metallization and photovoltaic device formed therefrom | Kathryn C. Fisher, Qiang Huang, Satyavolu S. Papa Rao | 2019-01-01 |
| 10090247 | Semiconductor device formed by wet etch removal of Ru selective to other metals | Benjamin D. Briggs, Cornelius Brown Peethala | 2018-10-02 |
| 10074562 | Self aligned contact structure | Rosa A. Orozco-Teran, Ravikumar Ramachandran, John A. Fitzsimmons, Russell H. Arndt | 2018-09-11 |
| 10049802 | Patterning magnetic films using self-stop electro-etching | Eugene J. O'Sullivan, Naigang Wang | 2018-08-14 |
| 10043663 | Enhanced defect reduction for heteroepitaxy by seed shape engineering | Cheng-Wei Cheng, Devendra K. Sadana, Kuen-Ting Shiu, Brent A. Wacaser | 2018-08-07 |
| 10002831 | Selective and non-selective barrier layer wet removal | Benjamin D. Briggs, Elbert E. Huang, Raghuveer R. Patlolla, Cornelius Brown Peethala, Hosadurga Shobha | 2018-06-19 |
| 9911690 | Interconnect structures with fully aligned vias | Daniel C. Edelstein, Nicholas C. M. Fuller, Elbert E. Huang, Satyanarayana V. Nitta | 2018-03-06 |
| 9881833 | Barrier planarization for interconnect metallization | Benjamin D. Briggs, Elbert E. Huang, Takeshi Nogami, Raghuveer R. Patlolla, Cornelius Brown Peethala | 2018-01-30 |
| 9806023 | Selective and non-selective barrier layer wet removal | Benjamin D. Briggs, Elbert E. Huang, Raghuveer R. Patlolla, Cornelius Brown Peethala, Hosadurga Shobha | 2017-10-31 |
| 9735224 | Patterning magnetic films using self-stop electro-etching | Eugene J. O'Sullivan, Naigang Wang | 2017-08-15 |