| 12062614 |
Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements |
Jack O. Chu, Kam-Leung Lee, Ahmet S. Ozcan, Paul M. Solomon, Jeng-Bang Yau |
2024-08-13 |
$23,564,000 |
| 12048254 |
Sacrificial material facilitating protection of a substrate in a qubit device |
Vivekananda P. Adiga, Martin O. Sandberg, Jeng-Bang Yau, David L. Rath, Cihan Kurter +2 more |
2024-07-23 |
|
| 11862567 |
Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements |
Jack O. Chu, Kam-Leung Lee, Ahmet S. Ozcan, Paul M. Solomon, Jeng-Bang Yau |
2024-01-02 |
$10,021,000 |
| 11765985 |
Spurious junction prevention via in-situ ion milling |
Vivekananda P. Adiga, Martin O. Sandberg, Jeng-Bang Yau, Keith E. Fogel, Markus Brink +1 more |
2023-09-19 |
$7,535,000 |
| 11552237 |
Grain size control of superconducting materials in thin films for Josephson junctions |
Benjamin Wymore, Christian Lavoie, Markus Brink |
2023-01-10 |
$10,956,000 |
| 11152214 |
Structures and methods for equivalent oxide thickness scaling on silicon germanium channel or III-V channel of semiconductor device |
Takashi Ando, Eduard A. Cartier, Martin M. Frank, Vijay Narayanan, John Rozen |
2021-10-19 |
$2,168,000 |
| 11101219 |
Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements |
Jack O. Chu, Kam-Leung Lee, Ahmet S. Ozcan, Paul M. Solomon, Jeng-Bang Yau |
2021-08-24 |
$4,861,000 |
| 10985105 |
Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements |
Jack O. Chu, Kam-Leung Lee, Ahmet S. Ozcan, Paul M. Solomon, Jeng-Bang Yau |
2021-04-20 |
$5,008,000 |
| 10529832 |
Shallow, abrupt and highly activated tin extension implant junction |
Marinus Hopstaken, Kam-Leung Lee |
2020-01-07 |
$1,754,000 |
| 10505112 |
CMOS compatible non-filamentary resistive memory stack |
Takashi Ando, Eduard A. Cartier, Adam M. Pyzyna |
2019-12-10 |
$5,388,000 |
| 10269714 |
Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements |
Jack O. Chu, Kam-Leung Lee, Ahmet S. Ozcan, Paul M. Solomon, Jeng-Bang Yau |
2019-04-23 |
$3,141,000 |
| 9812530 |
High germanium content silicon germanium fins |
Karthik Balakrishnan, Pouya Hashemi, Ali Khakifirooz, John A. Ott, Alexander Reznicek |
2017-11-07 |
$4,555,000 |
| 9551674 |
Method of producing an un-distorted dark field strain map at high spatial resolution through dark field electron holography |
Yun-Yu Wang |
2017-01-24 |
$6,909,000 |
| 9324843 |
High germanium content silicon germanium fins |
Karthik Balakrishnan, Pouya Hashemi, Ali Khakifirooz, John A. Ott, Alexander Reznicek |
2016-04-26 |
$2,956,000 |
| 8741713 |
Reliable physical unclonable function for device authentication |
Vijay Narayanan, Dirk Pfeiffer, Jean-Oliver Plouchart, Peilin Song |
2014-06-03 |
$4,638,000 |
| 7247946 |
On-chip Cu interconnection using 1 to 5 nm thick metal cap |
Roy A. Carruthers, Lynne M. Gignac, Chao-Kun Hu, Eric G. Liniger, Sandra G. Malhotra +1 more |
2007-07-24 |
$9,916,000 |
| 7015469 |
Electron holography method |
Yun-Yu Wang, Masahiro Kawasaki, Anthony G. Domenicucci, Michael A. Gribelyuk, John G. Gaudiello |
2006-03-21 |
$6,971,000 |
| 6884641 |
Site-specific methodology for localization and analyzing junction defects in mosfet devices |
Terence L. Kane, Michael P. Tenney, Yun-Yu Wang |
2005-04-26 |
$8,819,000 |
| 6878624 |
Pre-anneal of CoSi, to prevent formation of amorphous layer between Ti-O-N and CoSi |
Cyril Cabral, Jr., Christian Lavoie, Tina Wagner, Yun-Yu Wang, Horati S. Wildman +1 more |
2005-04-12 |
$5,340,000 |
| 6875982 |
Electron microscope magnification standard providing precise calibration in the magnification range 5000X-2000,000X |
Stephen W. Bedell, Anthony G. Domenicucci, Devendra K. Sadana |
2005-04-05 |
$5,479,000 |
