Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062614 | Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements | Jack O. Chu, Kam-Leung Lee, Ahmet S. Ozcan, Paul M. Solomon, Jeng-Bang Yau | 2024-08-13 |
| 12048254 | Sacrificial material facilitating protection of a substrate in a qubit device | Vivekananda P. Adiga, Martin O. Sandberg, Jeng-Bang Yau, David L. Rath, Cihan Kurter +2 more | 2024-07-23 |
| 11862567 | Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements | Jack O. Chu, Kam-Leung Lee, Ahmet S. Ozcan, Paul M. Solomon, Jeng-Bang Yau | 2024-01-02 |
| 11765985 | Spurious junction prevention via in-situ ion milling | Vivekananda P. Adiga, Martin O. Sandberg, Jeng-Bang Yau, Keith E. Fogel, Markus Brink +1 more | 2023-09-19 |
| 11552237 | Grain size control of superconducting materials in thin films for Josephson junctions | Benjamin Wymore, Christian Lavoie, Markus Brink | 2023-01-10 |
| 11152214 | Structures and methods for equivalent oxide thickness scaling on silicon germanium channel or III-V channel of semiconductor device | Takashi Ando, Eduard A. Cartier, Martin M. Frank, Vijay Narayanan, John Rozen | 2021-10-19 |
| 11101219 | Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements | Jack O. Chu, Kam-Leung Lee, Ahmet S. Ozcan, Paul M. Solomon, Jeng-Bang Yau | 2021-08-24 |
| 10985105 | Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements | Jack O. Chu, Kam-Leung Lee, Ahmet S. Ozcan, Paul M. Solomon, Jeng-Bang Yau | 2021-04-20 |
| 10529832 | Shallow, abrupt and highly activated tin extension implant junction | Marinus Hopstaken, Kam-Leung Lee | 2020-01-07 |
| 10505112 | CMOS compatible non-filamentary resistive memory stack | Takashi Ando, Eduard A. Cartier, Adam M. Pyzyna | 2019-12-10 |
| 10269714 | Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements | Jack O. Chu, Kam-Leung Lee, Ahmet S. Ozcan, Paul M. Solomon, Jeng-Bang Yau | 2019-04-23 |
| 9812530 | High germanium content silicon germanium fins | Karthik Balakrishnan, Pouya Hashemi, Ali Khakifirooz, John A. Ott, Alexander Reznicek | 2017-11-07 |
| 9551674 | Method of producing an un-distorted dark field strain map at high spatial resolution through dark field electron holography | Yun-Yu Wang | 2017-01-24 |
| 9324843 | High germanium content silicon germanium fins | Karthik Balakrishnan, Pouya Hashemi, Ali Khakifirooz, John A. Ott, Alexander Reznicek | 2016-04-26 |
| 8741713 | Reliable physical unclonable function for device authentication | Vijay Narayanan, Dirk Pfeiffer, Jean-Oliver Plouchart, Peilin Song | 2014-06-03 |
| 7247946 | On-chip Cu interconnection using 1 to 5 nm thick metal cap | Roy A. Carruthers, Lynne M. Gignac, Chao-Kun Hu, Eric G. Liniger, Sandra G. Malhotra +1 more | 2007-07-24 |
| 7015469 | Electron holography method | Yun-Yu Wang, Masahiro Kawasaki, Anthony G. Domenicucci, Michael A. Gribelyuk, John G. Gaudiello | 2006-03-21 |
| 6884641 | Site-specific methodology for localization and analyzing junction defects in mosfet devices | Terence L. Kane, Michael P. Tenney, Yun-Yu Wang | 2005-04-26 |
| 6878624 | Pre-anneal of CoSi, to prevent formation of amorphous layer between Ti-O-N and CoSi | Cyril Cabral, Jr., Christian Lavoie, Tina Wagner, Yun-Yu Wang, Horati S. Wildman +1 more | 2005-04-12 |
| 6875982 | Electron microscope magnification standard providing precise calibration in the magnification range 5000X-2000,000X | Stephen W. Bedell, Anthony G. Domenicucci, Devendra K. Sadana | 2005-04-05 |