Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11557482 | Electrode with alloy interface | Chih-Chao Yang, Daniel C. Edelstein, Oscar van der Straten | 2023-01-17 |
| 10943863 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Christian Lavoie, Stephen M. Rossnagel, Thomas M. Shaw | 2021-03-09 |
| 10818590 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Christian Lavoie, Stephen M. Rossnagel, Thomas M. Shaw | 2020-10-27 |
| 10580740 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Lawrence A. Clevenger, Takeshi Nogami, Deepika Priyadarshini, Michael Rizzolo | 2020-03-03 |
| 10461026 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Christian Lavoie, Stephen M. Rossnagel, Thomas M. Shaw | 2019-10-29 |
| 10192829 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Lawrence A. Clevenger, Takeshi Nogami, Deepika Priyadarshini, Michael Rizzolo | 2019-01-29 |
| 9759766 | Electromigration test structure for Cu barrier integrity and blech effect evaluations | Griselda Bonilla, Elbert E. Huang, Baozhen Li, Paul S. McLaughlin | 2017-09-12 |
| 9754891 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Lawrence A. Clevenger, Takeshi Nogami, Deepika Priyadarshini, Michael Rizzolo | 2017-09-05 |
| 9472477 | Electromigration test structure for Cu barrier integrity and blech effect evaluations | Griselda Bonilla, Elbert E. Huang, Baozhen Li, Paul S. McLaughlin | 2016-10-18 |
| 9111938 | Copper interconnect with CVD liner and metallic cap | Frieder H. Baumann, Tibor Bolom, Koichi Motoyama, Chengyu Niu, Andrew H. Simon | 2015-08-18 |
| 9059176 | Copper interconnect with CVD liner and metallic cap | Frieder H. Baumann, Andrew H. Simon, Tibor Bolom, Koichi Motoyama, Chengyu Niu | 2015-06-16 |
| 8889546 | Discontinuous/non-uniform metal cap structure and process for interconnect integration | Chih-Chao Yang, Lynne M. Gignac, Surbhi Mittal | 2014-11-18 |
| 8823176 | Discontinuous/non-uniform metal cap structure and process for interconnect integration | Chih-Chao Yang, Lynne M. Gignac, Surbhi Mittal | 2014-09-02 |
| 8796853 | Metallic capped interconnect structure with high electromigration resistance and low resistivity | Chih-Chao Yang | 2014-08-05 |
| 8232196 | Interconnect structure having a via with a via gouging feature and dielectric liner sidewalls for BEOL integration | Chih-Chao Yang | 2012-07-31 |
| 8232646 | Interconnect structure for integrated circuits having enhanced electromigration resistance | Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Naftali E. Lustig +2 more | 2012-07-31 |
| 8133767 | Efficient interconnect structure for electrical fuse applications | Chih-Chao Yang, Lynne M. Gignac | 2012-03-13 |
| 8056039 | Interconnect structure for integrated circuits having improved electromigration characteristics | Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Sujatha Sankaran, Andrew H. Simon +1 more | 2011-11-08 |
| 8039966 | Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnects | Chih-Chao Yang | 2011-10-18 |
| 8026166 | Interconnect structures comprising capping layers with low dielectric constants and methods of making the same | Griselda Bonilla, Tien-Jen Cheng, Lawrence A. Clevenger, Stephan Grunow, Roger A. Quon +5 more | 2011-09-27 |
| 8013446 | Nitrogen-containing metal cap for interconnect structures | Chih-Chao Yang | 2011-09-06 |
| 7893520 | Efficient interconnect structure for electrical fuse applications | Chih-Chao Yang, Lynne M. Gignac | 2011-02-22 |
| 7737528 | Structure and method of forming electrically blown metal fuses for integrated circuits | Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Jeffrey P. Gambino, Stephan Grunow +3 more | 2010-06-15 |
| 7468320 | Reduced electromigration and stressed induced migration of copper wires by surface coating | Robert Rosenberg, Judith M. Rubino, Carlos J. Sambucetti, Anthony K. Stamper | 2008-12-23 |
| 7439173 | Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy via | Stephen E. Greco, Paul S. McLaughlin | 2008-10-21 |