Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553497 | Methods and devices for enhancing mobility of charge carriers | John H. Zhang, Heng Yang | 2020-02-04 |
| 10546789 | Methods of forming metal-gate semiconductor devices with enhanced mobility of charge carriers | John H. Zhang, Heng Yang | 2020-01-28 |
| 10438856 | Methods and devices for enhancing mobility of charge carriers | John H. Zhang, Heng Yang | 2019-10-08 |
| 10283608 | Low resistance contacts to source or drain region of transistor | Xunyuan Zhang, Frank W. Mont, Mark V. Raymond | 2019-05-07 |
| 10026693 | Method, apparatus, and system for MOL interconnects without titanium liner | Vimal Kamineni, Mark V. Raymond, Praneet Adusumilli | 2018-07-17 |
| 9859217 | Middle of the line (MOL) metal contacts | Vimal Kamineni, Mark V. Raymond, Xunyuan Zhang | 2018-01-02 |
| 9721889 | Middle of the line (MOL) metal contacts | Vimal Kamineni, Mark V. Raymond, Xunyuan Zhang | 2017-08-01 |
| 9679807 | Method, apparatus, and system for MOL interconnects without titanium liner | Vimal Kamineni, Mark V. Raymond, Praneet Adusumilli | 2017-06-13 |
| 9111938 | Copper interconnect with CVD liner and metallic cap | Frieder H. Baumann, Tibor Bolom, Chao-Kun Hu, Koichi Motoyama, Andrew H. Simon | 2015-08-18 |
| 9059176 | Copper interconnect with CVD liner and metallic cap | Frieder H. Baumann, Chao-Kun Hu, Andrew H. Simon, Tibor Bolom, Koichi Motoyama | 2015-06-16 |
| 8729702 | Copper seed layer for an interconnect structure having a doping concentration level gradient | Andrew H. Simon, Keith Kwong Hon Wong, Yun-Yu Wang | 2014-05-20 |
| 8493171 | Dual thin film precision resistance trimming | Olivier Le Neel, Pascale Dumont-Girard, Fuchao Wang, Michel Arnoux | 2013-07-23 |
| 8400257 | Via-less thin film resistor with a dielectric cap | Ting Fang Lim, Olivier Le Neel, Calvin Leung | 2013-03-19 |
| 8242876 | Dual thin film precision resistance trimming | Olivier Le Neel, Pascale Dumont-Girard, Fuchao Wang, Michel Arnoux | 2012-08-14 |