Issued Patents All Time
Showing 1–25 of 124 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12276565 | Electrical test of optical components via metal-insulator-semiconductor capacitor structures | Ravi S. Tummidi, Tony P. Polous, Mark A. Webster | 2025-04-15 |
| 11906824 | Optical modulator using monocrystalline and polycrystalline silicon | Vipulkumar Patel, Prakash Gothoskar, Ming Gai Stanley LO | 2024-02-20 |
| RE49820 | Semiconductor device having a self-forming barrier layer at via bottom | Larry Zhao, Ming He, Sean Xuan Lin | 2024-01-30 |
| 11860417 | Precision spacing control for optical waveguides | — | 2024-01-02 |
| 11754784 | Grating coupler | Tao Ling, Shiyi Chen, Prakash Gothoskar | 2023-09-12 |
| 11742451 | Integrate stressor with Ge photodiode using a substrate removal process | Li Li, Prakash Gothoskar, Soha Namnabat | 2023-08-29 |
| 11686648 | Electrical test of optical components via metal-insulator-semiconductor capacitor structures | Ravi S. Tummidi, Tony P. Polous, Mark A. Webster | 2023-06-27 |
| 11619838 | Optical modulator using monocrystalline and polycrystalline silicon | Vipulkumar Patel, Prakash Gothoskar, Ming Gai Stanley LO | 2023-04-04 |
| 11114338 | Fully aligned via in ground rule region | Nicholas V. LiCausi | 2021-09-07 |
| 11036069 | Optical modulator using monocrystalline and polycrystalline silicon | Vipulkumar Patel, Prakash Gothoskar, Ming Gai Stanley LO | 2021-06-15 |
| 11022757 | Using an anti-reflection coating with a grating coupler | Shiyi Chen, Tao Ling, Prakash Gothoskar | 2021-06-01 |
| 10969546 | Electro-optic modulator with monocrystalline semiconductor waveguides | Vipulkumar Patel, Prakash Gothoskar | 2021-04-06 |
| 10679937 | Devices and methods of forming low resistivity noble metal interconnect | Frank W. Mont, Errol Todd Ryan | 2020-06-09 |
| 10643845 | Repaired mask structures and resultant underlying patterned structures | Ruilong Xie, Yi Qi | 2020-05-05 |
| 10636698 | Skip via structures | Frank W. Mont, Errol Todd Ryan | 2020-04-28 |
| 10636656 | Methods of protecting structure of integrated circuit from rework | Lei Sun, Frank W. Mont, Shao Beng Law | 2020-04-28 |
| 10627720 | Overlay mark structures | Lei Sun, John H. Zhang, Shao Beng Law, Guoxiang Ning, Ruilong Xie | 2020-04-21 |
| 10629428 | Metal insulator metal capacitor devices | Shariq Siddiqui, Han You, Rohit Galatage, Roger QUON, Christopher J. Penny | 2020-04-21 |
| 10573593 | Metal interconnects for super (skip) via integration | Sean Xuan Lin, Shao Beng Law, James Jay McMahon | 2020-02-25 |
| 10553478 | IC structure with interface liner and methods of forming same | Moosung Chae | 2020-02-04 |
| 10546854 | Methods of forming V0 structures for semiconductor devices by forming a protection layer with a non-uniform thickness | Ruilong Xie | 2020-01-28 |
| 10485111 | Via and skip via structures | Shao Beng Law, Nicholas V. LiCausi, Errol Todd Ryan, James Jay McMahon, Ryan Smith | 2019-11-19 |
| RE47630 | Semiconductor device having a self-forming barrier layer at via bottom | Larry Zhao, Ming He, Sean Xuan Lin | 2019-10-01 |
| 10366919 | Fully aligned via in ground rule region | Nicholas V. LiCausi | 2019-07-30 |
| 10283372 | Interconnects formed by a metal replacement process | Sean Xuan Lin, Mark V. Raymond, Errol Todd Ryan, Nicholas V. LiCausi | 2019-05-07 |