Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062083 | Automated data entry optimization by recognizing invalid data | Daniel Wade Hitchcock | 2021-07-13 |
| 10957588 | Chamferless via structures | Mark L. Lenhardt, Frank W. Mont, Brown C. Peethala, Jessica P. Striss, Douglas M. Trickett | 2021-03-23 |
| 10937694 | Chamferless via structures | Mark L. Lenhardt, Frank W. Mont, Brown C. Peethala, Jessica P. Striss, Douglas M. Trickett | 2021-03-02 |
| 10903118 | Chamferless via structures | Mark L. Lenhardt, Frank W. Mont, Brown C. Peethala, Jessica P. Striss, Douglas M. Trickett | 2021-01-26 |
| 10818599 | Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contacts | Hiroaki Niimi, Tenko Yamashita | 2020-10-27 |
| 10658176 | Methods of mitigating cobalt diffusion in contact structures and the resulting devices | Frank W. Mont, Han You, Brown C. Peethala | 2020-05-19 |
| 10629428 | Metal insulator metal capacitor devices | Han You, Xunyuan Zhang, Rohit Galatage, Roger QUON, Christopher J. Penny | 2020-04-21 |
| 10554657 | Using an audio interface device to authenticate another device | Daniel Wade Hitchcock, Bharath Kumar Bhimanaik, Natalie Nguyen, Annabelle Richard Backman | 2020-02-04 |
| 10388565 | Chamferless via structures | Mark L. Lenhardt, Frank W. Mont, Brown C. Peethala, Jessica P. Striss, Douglas M. Trickett | 2019-08-20 |
| 10347541 | Active gate contacts and method of fabrication thereof | Jiehui Shu, David Paul Brunco, Pei Liu, Jinping Liu | 2019-07-09 |
| 10340146 | Reliability caps for high-k dielectric anneals | Rohit Galatage, Chung-Ju Yang | 2019-07-02 |
| 10211094 | Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contacts | Hiroaki Niimi, Tenko Yamashita | 2019-02-19 |
| 10170574 | Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contacts | Hiroaki Niimi, Tenko Yamashita | 2019-01-01 |
| 10139358 | Method for characterization of a layered structure | Lisa F. Edge, Gangadhara Raja Muthinti | 2018-11-27 |
| 10134585 | Low temperature atomic layer deposition of oxides on compound semiconductors | Kasra Sardashti, Tobin Kaufman-Osborn, Tyler Kent, Andrew C. Kummel, Bhagawan Sahu +2 more | 2018-11-20 |
| 10062560 | Method of cleaning semiconductor device | Kevin J. Ryan, Frank W. Mont, Cornelius Brown Peethala | 2018-08-28 |
| 10057227 | Determination of authentication mechanism | Blake Hess, Leo Parker Dirac, Alejandro Fonseca | 2018-08-21 |
| 10032668 | Chamferless via structures | Mark L. Lenhardt, Frank W. Mont, Brown C. Peethala, Jessica P. Striss, Douglas M. Trickett | 2018-07-24 |
| 9947547 | Environmentally green process and composition for cobalt wet etch | Frank W. Mont, Cornelius Brown Peethala, Randolph F. Knarr | 2018-04-17 |
| 9853115 | Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contacts | Hiroaki Niimi, Tenko Yamashita | 2017-12-26 |
| 9799559 | Methods employing sacrificial barrier layer for protection of vias during trench formation | Frank W. Mont, Xunyuan Zhang, Brown C. Peethala, Douglas M. Trickett | 2017-10-24 |
| 9613862 | Chamferless via structures | Mark L. Lenhardt, Frank W. Mont, Brown C. Peethala, Jessica P. Striss, Douglas M. Trickett | 2017-04-04 |
| 9570344 | Method to protect MOL metallization from hardmask strip process | Vimal Kamineni, Nicholas V. LiCausi, Jeremy A. Wahl | 2017-02-14 |
| 9508560 | SiARC removal with plasma etch and fluorinated wet chemical solution combination | Yann Mignot, Brown C. Peethala | 2016-11-29 |
| 9484255 | Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contacts | Hiroaki Niimi, Tenko Yamashita | 2016-11-01 |