Issued Patents All Time
Showing 1–25 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142516 | Self aligned buried power rail | Guillaume Bouche, Lars Liebmann | 2024-11-12 |
| 11398378 | Metal on metal multiple patterning | Hsueh-Chung Chen, Ravi Prakash Srivastava, Somnath Ghosh, Terry A. Spooner, Sean Reidy | 2022-07-26 |
| 11309210 | Self aligned buried power rail | Guillaume Bouche, Lars Liebmann | 2022-04-19 |
| 11158574 | Methods of forming a conductive contact structure to an embedded memory device on an IC product and a corresponding IC product | Julien Frougier, Keith Donegan, Hyung Woo Kim | 2021-10-26 |
| 11121087 | Methods of forming a conductive contact structure to an embedded memory device on an IC product and a corresponding IC product | Julien Frougier, Keith Donegan, Hyung Woo Kim | 2021-09-14 |
| 11114338 | Fully aligned via in ground rule region | Xunyuan Zhang | 2021-09-07 |
| 11101169 | Interconnect structures with airgaps arranged between capped interconnects | — | 2021-08-24 |
| 10978388 | Skip via for metal interconnects | Hari Prasad Amanapu, Prasad Bhosale, Lars Liebmann, James Jay McMahon, Cornelius Brown Peethala +1 more | 2021-04-13 |
| 10832944 | Interconnect structure having reduced resistance variation and method of forming same | Chanro Park, Ruilong Xie, Andre P. Labonte | 2020-11-10 |
| 10818494 | Metal on metal multiple patterning | Hsueh-Chung Chen, Ravi Prakash Srivastava, Somnath Ghosh, Terry A. Spooner, Sean Reidy | 2020-10-27 |
| 10770392 | Line end structures for semiconductor devices | Shao Beng Law | 2020-09-08 |
| 10707119 | Interconnect structures with airgaps and dielectric-capped interconnects | Jeremy A. Wahl, Vimal Kamineni | 2020-07-07 |
| 10677855 | Structure, method and system for measuring RIE lag depth | — | 2020-06-09 |
| 10622266 | Methods of identifying space within integrated circuit structure as mandrel space or non-mandrel space | Erik Verduijn, Genevieve Beique, Lei Sun, Francis Goodwin | 2020-04-14 |
| 10580696 | Interconnects formed by a metal displacement reaction | Sean Xuan Lin, Christian Witt, Mark V. Raymond, Errol Todd Ryan | 2020-03-03 |
| 10485111 | Via and skip via structures | Shao Beng Law, Errol Todd Ryan, James Jay McMahon, Ryan Smith, Xunyuan Zhang | 2019-11-19 |
| 10475692 | Self aligned buried power rail | Guillaume Bouche, Lars Liebmann | 2019-11-12 |
| 10366919 | Fully aligned via in ground rule region | Xunyuan Zhang | 2019-07-30 |
| 10304833 | Method of forming complementary nano-sheet/wire transistor devices with same depth contacts | Puneet Harischandra Suvarna, Bipul C. Paul, Ruilong Xie, Bartlomiej Jan Pawlak, Lars Liebmann +2 more | 2019-05-28 |
| 10283372 | Interconnects formed by a metal replacement process | Sean Xuan Lin, Xunyuan Zhang, Mark V. Raymond, Errol Todd Ryan | 2019-05-07 |
| 10211100 | Methods of forming an air gap adjacent a gate of a transistor and a gate contact above the active region of the transistor | Ruilong Xie, Lars Liebmann, Nigel G. Cave, Andre P. Labonte, Guillaume Bouche +1 more | 2019-02-19 |
| 10199261 | Via and skip via structures | James Jay McMahon, Ryan Smith, Errol Todd Ryan, Xunyuan Zhang, Shao Beng Law | 2019-02-05 |
| 10177028 | Method for manufacturing fully aligned via structures having relaxed gapfills | Errol Todd Ryan | 2019-01-08 |
| 10163633 | Non-mandrel cut formation | Shao Beng Law, Xunyuan Zhang, Errol Todd Ryan | 2018-12-25 |
| 10134580 | Metallization levels and methods of making thereof | Errol Todd Ryan, Sean Xuan Lin | 2018-11-20 |