Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199177 | High-electron-mobility transistors with inactive gate blocks | Abhinay Sandupatla, Bartłomiej Jan Pawlak | 2025-01-14 |
| 11145349 | Physically unclonable function architecture including memory cells with parallel-connected access transistors and common write wordlines | Bartlomiej Jan Pawlak | 2021-10-12 |
| 10886215 | Interconnect structure and related methods | Houman Zahedmanesh, Victoria L. Calero Diaz Del Castillo | 2021-01-05 |
| 10580696 | Interconnects formed by a metal displacement reaction | Sean Xuan Lin, Mark V. Raymond, Nicholas V. LiCausi, Errol Todd Ryan | 2020-03-03 |
| 10224284 | Soluble self aligned barrier layer for interconnect structure | — | 2019-03-05 |
| 10109524 | Recessing of liner and conductor for via formation | — | 2018-10-23 |
| 9768058 | Methods of forming air gaps in metallization layers on integrated circuit products | Zhiguo Sun, Qiang Fang | 2017-09-19 |
| 9236299 | Methods of forming a metal cap layer on copper-based conductive structures on an integrated circuit device | Xunyuan Zhang, Hoon Kim, Larry Zhao | 2016-01-12 |
| 9054052 | Methods for integration of pore stuffing material | Nicholas V. LiCausi, Errol Todd Ryan, Ming He, Moosung Chae, Kunaljeet Tanwar +4 more | 2015-06-09 |
| 8932934 | Methods of self-forming barrier integration with pore stuffed ULK material | Moosung Chae, Errol Todd Ryan, Nicholas V. LiCausi, Ailian Zhao, Ming He +3 more | 2015-01-13 |
| 8580665 | MOSFET integrated circuit having doped conductive interconnects and methods for its manufacture | — | 2013-11-12 |
| 7696093 | Methods for forming copper interconnects for semiconductor devices | — | 2010-04-13 |
| 7615491 | Defectivity and process control of electroless deposition in microelectronics applications | Qingyun Chen, Charles Valverde, Vincent Paneccasio, Jr., Nicolai Petrov, Daniel Stritch +1 more | 2009-11-10 |
| 7611987 | Defectivity and process control of electroless deposition in microelectronics applications | Qingyun Chen, Charles Valverde, Vincent Paneccasio, Jr., Nicolai Petrov, Daniel Stritch +1 more | 2009-11-03 |
| 7611988 | Defectivity and process control of electroless deposition in microelectronics applications | Qingyun Chen, Charles Valverde, Vincent Paneccasio, Jr., Nicolai Petrov, Daniel Stritch +1 more | 2009-11-03 |
| 7410899 | Defectivity and process control of electroless deposition in microelectronics applications | Qingyun Chen, Charles Valverde, Vincent Paneccasio, Jr., Nicolai Petrov, Daniel Stritch +1 more | 2008-08-12 |
| 7393781 | Capping of metal interconnects in integrated circuit electronic devices | Eric Yakobson, Richard Hurtubise, Qingyun Chen | 2008-07-01 |
| 7332193 | Cobalt and nickel electroless plating in microelectronic devices | Charles Valverde, Nicolai Petrov, Eric Yakobson, Qingyun Chen, Vincent Paneccasio, Jr. +1 more | 2008-02-19 |
| 7268074 | Capping of metal interconnects in integrated circuit electronic devices | Eric Yakobson, Richard Hurtubise, Qingyun Chen | 2007-09-11 |