Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12157944 | Method and wet chemical compositions for diffusion barrier formation | Eric Yakobson, Shaopeng Sun, Taylor L. Wilkins, Elie H. Najjar, Wenbo Shao | 2024-12-03 |
| 11846018 | Method and wet chemical compositions for diffusion barrier formation | Eric Yakobson, Shaopeng Sun, Taylor L. Wilkins, Elie H. Najjar, Wenbo Shao | 2023-12-19 |
| 11697884 | Copper deposition in wafer level packaging of integrated circuits | Thomas B. Richardson, Kyle Whitten, Vincent Paneccasio, Jr., John Commander | 2023-07-11 |
| RE49202 | Copper electrodeposition in microelectronics | Vincent Paneccasio, Jr., Xuan Lin, Paul Figura | 2022-09-06 |
| 11124888 | Copper deposition in wafer level packaging of integrated circuits | Thomas B. Richardson, Kyle Whitten, Vincent Paneccasio, Jr., John Commander | 2021-09-21 |
| 10221496 | Copper filling of through silicon vias | Thomas B. Richardson, Wenbo Shao, Xuan Lin, Cai Wang, Vincent Paneccasio, Jr. +3 more | 2019-03-05 |
| 9613858 | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers | Vincent Paneccasio, Jr., Xuan Lin, Qingyun Chen | 2017-04-04 |
| 9493884 | Copper electrodeposition in microelectronics | Vincent Paneccasio, Jr., Xuan Lin, Paul Figura | 2016-11-15 |
| 9222188 | Defect reduction in electrodeposited copper for semiconductor applications | John Commander, Vincent Paneccasio, Jr., Xuan Lin, Kshama Jirage | 2015-12-29 |
| 8771495 | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers | Vincent Paneccasio, Jr., Xuan Lin, Qingyun Chen | 2014-07-08 |
| 8608933 | Copper electrodeposition in microelectronics | Vincent Paneccasio, Jr., Xuan Lin, Paul Figura | 2013-12-17 |
| 8388824 | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers | Vincent Paneccasio, Jr., Xuan Lin, Qingyun Chen | 2013-03-05 |
| 8002962 | Copper electrodeposition in microelectronics | Vincent Paneccasio, Jr., Xuan Lin, Paul Figura | 2011-08-23 |
| 7998859 | Surface preparation process for damascene copper deposition | Qingyun Chen, Xuan Lin, Vincent Paneccasio, Jr., Joseph A. Abys | 2011-08-16 |
| 7968455 | Copper deposition for filling features in manufacture of microelectronic devices | Xuan Lin, Vincent Paneccasio, Jr., Qingyun Chen | 2011-06-28 |
| 7815786 | Copper electrodeposition in microelectronics | Vincent Paneccasio, Jr., Xuan Lin, Paul Figura | 2010-10-19 |
| 7704306 | Manufacture of electroless cobalt deposition compositions for microelectronics applications | Qingyun Chen, Vincent Paneccasio, Jr., Charles Valverde, Daniel Stritch | 2010-04-27 |
| 7670950 | Copper metallization of through silicon via | Thomas B. Richardson, Yun Zhang, Chen Wang, Vincent Paneccasio, Jr., Cai Wang +2 more | 2010-03-02 |
| 7615491 | Defectivity and process control of electroless deposition in microelectronics applications | Qingyun Chen, Charles Valverde, Vincent Paneccasio, Jr., Nicolai Petrov, Daniel Stritch +1 more | 2009-11-10 |
| 7611987 | Defectivity and process control of electroless deposition in microelectronics applications | Qingyun Chen, Charles Valverde, Vincent Paneccasio, Jr., Nicolai Petrov, Daniel Stritch +1 more | 2009-11-03 |
| 7611988 | Defectivity and process control of electroless deposition in microelectronics applications | Qingyun Chen, Charles Valverde, Vincent Paneccasio, Jr., Nicolai Petrov, Daniel Stritch +1 more | 2009-11-03 |
| 7410899 | Defectivity and process control of electroless deposition in microelectronics applications | Qingyun Chen, Charles Valverde, Vincent Paneccasio, Jr., Nicolai Petrov, Daniel Stritch +1 more | 2008-08-12 |
| 7393781 | Capping of metal interconnects in integrated circuit electronic devices | Eric Yakobson, Christian Witt, Qingyun Chen | 2008-07-01 |
| 7332193 | Cobalt and nickel electroless plating in microelectronic devices | Charles Valverde, Nicolai Petrov, Eric Yakobson, Qingyun Chen, Vincent Paneccasio, Jr. +1 more | 2008-02-19 |
| 7316772 | Defect reduction in electrodeposited copper for semiconductor applications | John Commander, Vincent Paneccasio, Jr., Xuan Lin, Kshama Jirage | 2008-01-08 |