Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12398480 | Leveler compositions for use in copper deposition in manufacture of microelectronics | Kyle Whitten, Thomas B. Richardson, Ivan Li | 2025-08-26 |
| 12270121 | Composition and method for fabrication of nickel interconnects | Eric Yakobson, Shaopeng Sun, Elie H. Najjar, Thomas B. Richardson, Wenbo Shao +1 more | 2025-04-08 |
| 11697884 | Copper deposition in wafer level packaging of integrated circuits | Thomas B. Richardson, Kyle Whitten, John Commander, Richard Hurtubise | 2023-07-11 |
| 11434578 | Cobalt filling of interconnects in microelectronics | John Commander, Eric Rouya, Kyle Whitten, Shaopeng Sun, Jianwen Han | 2022-09-06 |
| RE49202 | Copper electrodeposition in microelectronics | Xuan Lin, Paul Figura, Richard Hurtubise | 2022-09-06 |
| 11401618 | Cobalt filling of interconnects | John Commander, Kyle Whitten, Shaopeng Sun, Eric Yakobson, Jianwen Han +1 more | 2022-08-02 |
| 11168406 | Leveler compositions for use in copper deposition in manufacture of microelectronics | Kyle Whitten, Thomas B. Richardson, Ivan Li | 2021-11-09 |
| 11124888 | Copper deposition in wafer level packaging of integrated circuits | Thomas B. Richardson, Kyle Whitten, John Commander, Richard Hurtubise | 2021-09-21 |
| 11035048 | Cobalt filling of interconnects | John Commander, Kyle Whitten, Shaopeng Sun, Eric Yakobson, Jianwen Han +1 more | 2021-06-15 |
| 10995417 | Cobalt filling of interconnects in microelectronics | John Commander, Eric Rouya, Kyle Whitten, Shaopeng Sun, Jianwen Han | 2021-05-04 |
| 10541140 | Process for filling vias in the microelectronics | Thomas B. Richardson, Joseph A. Abys, Wenbo Shao, Chen Wang, Cai Wang +2 more | 2020-01-21 |
| 10519557 | Leveler compositions for use in copper deposition in manufacture of microelectronics | Kyle Whitten, Thomas B. Richardson, Ivan Li | 2019-12-31 |
| 10294574 | Levelers for copper deposition in microelectronics | Kyle Whitten, Thomas B. Richardson, Eric Rouya | 2019-05-21 |
| 10221496 | Copper filling of through silicon vias | Thomas B. Richardson, Wenbo Shao, Xuan Lin, Cai Wang, Joseph A. Abys +3 more | 2019-03-05 |
| 10103029 | Process for filling vias in the microelectronics | Thomas B. Richardson, Joseph A. Abys, Wenbo Shao, Chen Wang, Cai Wang +2 more | 2018-10-16 |
| 9613858 | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers | Xuan Lin, Richard Hurtubise, Qingyun Chen | 2017-04-04 |
| 9493884 | Copper electrodeposition in microelectronics | Richard Hurtubise, Xuan Lin, Paul Figura | 2016-11-15 |
| 9222188 | Defect reduction in electrodeposited copper for semiconductor applications | John Commander, Richard Hurtubise, Xuan Lin, Kshama Jirage | 2015-12-29 |
| 8771495 | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers | Xuan Lin, Richard Hurtubise, Qingyun Chen | 2014-07-08 |
| 8608933 | Copper electrodeposition in microelectronics | Richard Hurtubise, Xuan Lin, Paul Figura | 2013-12-17 |
| 8388824 | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers | Xuan Lin, Richard Hurtubise, Qingyun Chen | 2013-03-05 |
| 8002962 | Copper electrodeposition in microelectronics | Xuan Lin, Paul Figura, Richard Hurtubise | 2011-08-23 |
| 7998859 | Surface preparation process for damascene copper deposition | Qingyun Chen, Xuan Lin, Richard Hurtubise, Joseph A. Abys | 2011-08-16 |
| 7968455 | Copper deposition for filling features in manufacture of microelectronic devices | Xuan Lin, Richard Hurtubise, Qingyun Chen | 2011-06-28 |
| 7815786 | Copper electrodeposition in microelectronics | Xuan Lin, Paul Figura, Richard Hurtubise | 2010-10-19 |