Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Copper deposition in wafer level packaging of integrated circuits

Copper deposition in wafer level packaging of integrated circuits

US Patent 11124888 · Granted Sep 21, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Leveler compositions for use in copper deposition in manufacture of microelectro2025
Leveler compositions for use in copper deposition in manufacture of microelectro2025
Leveler compositions for use in copper deposition in manufacture of microelectro2025
Composition and method for fabrication of nickel interconnects2025
Composition and method for fabrication of nickel interconnects2025
Composition and method for fabrication of nickel interconnects2025
Method and wet chemical compositions for diffusion barrier formation2024
Compositions and methods for the electrodeposition of nanotwinned copper2024
Compositions and methods for the electrodeposition of nanotwinned copper2024
Method and wet chemical compositions for diffusion barrier formation2023
Cobalt chemistry for smooth topology2023
Copper deposition in wafer level packaging of integrated circuits2023