Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11697884 | Copper deposition in wafer level packaging of integrated circuits | Thomas B. Richardson, Kyle Whitten, Vincent Paneccasio, Jr., Richard Hurtubise | 2023-07-11 |
| 11434578 | Cobalt filling of interconnects in microelectronics | Vincent Paneccasio, Jr., Eric Rouya, Kyle Whitten, Shaopeng Sun, Jianwen Han | 2022-09-06 |
| 11401618 | Cobalt filling of interconnects | Kyle Whitten, Vincent Paneccasio, Jr., Shaopeng Sun, Eric Yakobson, Jianwen Han +1 more | 2022-08-02 |
| 11124888 | Copper deposition in wafer level packaging of integrated circuits | Thomas B. Richardson, Kyle Whitten, Vincent Paneccasio, Jr., Richard Hurtubise | 2021-09-21 |
| 11035048 | Cobalt filling of interconnects | Kyle Whitten, Vincent Paneccasio, Jr., Shaopeng Sun, Eric Yakobson, Jianwen Han +1 more | 2021-06-15 |
| 10995417 | Cobalt filling of interconnects in microelectronics | Vincent Paneccasio, Jr., Eric Rouya, Kyle Whitten, Shaopeng Sun, Jianwen Han | 2021-05-04 |
| 9222188 | Defect reduction in electrodeposited copper for semiconductor applications | Richard Hurtubise, Vincent Paneccasio, Jr., Xuan Lin, Kshama Jirage | 2015-12-29 |
| 7316772 | Defect reduction in electrodeposited copper for semiconductor applications | Richard Hurtubise, Vincent Paneccasio, Jr., Xuan Lin, Kshama Jirage | 2008-01-08 |
| 5578187 | Plating process for electroless nickel on zinc die castings | Mark W. Zitko, Victor J. Waldman | 1996-11-26 |
| 5435898 | Alkaline zinc and zinc alloy electroplating baths and processes | Victor J. Waldman | 1995-07-25 |
| 5061351 | Bright tin electrodeposition composition | Vincent Paneccasio, Jr. | 1991-10-29 |