Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11434578 | Cobalt filling of interconnects in microelectronics | John Commander, Vincent Paneccasio, Jr., Kyle Whitten, Shaopeng Sun, Jianwen Han | 2022-09-06 |
| 10995417 | Cobalt filling of interconnects in microelectronics | John Commander, Vincent Paneccasio, Jr., Kyle Whitten, Shaopeng Sun, Jianwen Han | 2021-05-04 |
| 10294574 | Levelers for copper deposition in microelectronics | Kyle Whitten, Vincent Paneccasio, Jr., Thomas B. Richardson | 2019-05-21 |