Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12398480 | Leveler compositions for use in copper deposition in manufacture of microelectronics | Vincent Paneccasio, Jr., Kyle Whitten, Ivan Li | 2025-08-26 |
| 12270121 | Composition and method for fabrication of nickel interconnects | Eric Yakobson, Shaopeng Sun, Elie H. Najjar, Vincent Paneccasio, Jr., Wenbo Shao +1 more | 2025-04-08 |
| 11873568 | Compositions and methods for the electrodeposition of nanotwinned copper | Kyle Whitten, Stephan I. Braye, Jianwen Han, Pingping Ye, Elie H. Najjar | 2024-01-16 |
| 11697884 | Copper deposition in wafer level packaging of integrated circuits | Kyle Whitten, Vincent Paneccasio, Jr., John Commander, Richard Hurtubise | 2023-07-11 |
| 11384446 | Compositions and methods for the electrodeposition of nanotwinned copper | Kyle Whitten, Stephan I. Braye, Jianwen Han, Pingping Ye, Elie H. Najjar | 2022-07-12 |
| 11168406 | Leveler compositions for use in copper deposition in manufacture of microelectronics | Vincent Paneccasio, Jr., Kyle Whitten, Ivan Li | 2021-11-09 |
| 11124888 | Copper deposition in wafer level packaging of integrated circuits | Kyle Whitten, Vincent Paneccasio, Jr., John Commander, Richard Hurtubise | 2021-09-21 |
| 10541140 | Process for filling vias in the microelectronics | Joseph A. Abys, Wenbo Shao, Chen Wang, Vincent Paneccasio, Jr., Cai Wang +2 more | 2020-01-21 |
| 10519557 | Leveler compositions for use in copper deposition in manufacture of microelectronics | Vincent Paneccasio, Jr., Kyle Whitten, Ivan Li | 2019-12-31 |
| 10294574 | Levelers for copper deposition in microelectronics | Kyle Whitten, Vincent Paneccasio, Jr., Eric Rouya | 2019-05-21 |
| 10221496 | Copper filling of through silicon vias | Wenbo Shao, Xuan Lin, Cai Wang, Vincent Paneccasio, Jr., Joseph A. Abys +3 more | 2019-03-05 |
| 10103029 | Process for filling vias in the microelectronics | Joseph A. Abys, Wenbo Shao, Chen Wang, Vincent Paneccasio, Jr., Cai Wang +2 more | 2018-10-16 |
| 9730321 | Silver plating in electronics manufacture | Yung-Herng Yau, Joseph A. Abys, Karl F. Wengenroth, Anthony Fiore, IV, Chen Xu +2 more | 2017-08-08 |
| 9657402 | Cyanide-free electrolyte composition and method for the deposition of silver or silver alloy layers on substrates | Stefan Schafer | 2017-05-23 |
| 9212427 | Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substrates | Stefan Schafer | 2015-12-15 |
| 8986434 | Silver plating in electronics manufacture | Yung-Herng Yau, Joseph A. Abys, Karl F. Wengenroth, Anthony Fiore, IV, Chen Xu +2 more | 2015-03-24 |
| 8349393 | Silver plating in electronics manufacture | Yung-Herng Yau, Joseph A. Abys, Karl F. Wengenroth, Anthony Fiore, IV, Chen Xu +2 more | 2013-01-08 |
| 7713859 | Tin-silver solder bumping in electronics manufacture | Marlies Kleinfeld, Christian Rietmann, Igor Zavarine, Ortrud Steinius, Yun Zhang +1 more | 2010-05-11 |
| 7670950 | Copper metallization of through silicon via | Yun Zhang, Chen Wang, Vincent Paneccasio, Jr., Cai Wang, Xuan Lin +2 more | 2010-03-02 |