| 12164032 |
Method for creating occupancy grid map and processing apparatus |
Naiyan Wang |
2024-12-10 |
| 11630210 |
Method for creating occupancy grid map and processing apparatus |
Naiyan Wang |
2023-04-18 |
| RE49202 |
Copper electrodeposition in microelectronics |
Vincent Paneccasio, Jr., Paul Figura, Richard Hurtubise |
2022-09-06 |
| 11315486 |
Image processing circuit and image processing method with overdriving illumination element |
Shang-Yu Su, Feng-Ting Pai |
2022-04-26 |
| 10541140 |
Process for filling vias in the microelectronics |
Thomas B. Richardson, Joseph A. Abys, Wenbo Shao, Chen Wang, Vincent Paneccasio, Jr. +2 more |
2020-01-21 |
| 10339895 |
Brightness compensation circuitry, and display device including the same |
Ya-Hsiang Tai, Chun-Yi Chang |
2019-07-02 |
| 10221496 |
Copper filling of through silicon vias |
Thomas B. Richardson, Wenbo Shao, Cai Wang, Vincent Paneccasio, Jr., Joseph A. Abys +3 more |
2019-03-05 |
| 9613858 |
Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers |
Vincent Paneccasio, Jr., Richard Hurtubise, Qingyun Chen |
2017-04-04 |
| 9493884 |
Copper electrodeposition in microelectronics |
Vincent Paneccasio, Jr., Richard Hurtubise, Paul Figura |
2016-11-15 |
| 9222188 |
Defect reduction in electrodeposited copper for semiconductor applications |
John Commander, Richard Hurtubise, Vincent Paneccasio, Jr., Kshama Jirage |
2015-12-29 |
| 8771495 |
Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers |
Vincent Paneccasio, Jr., Richard Hurtubise, Qingyun Chen |
2014-07-08 |
| 8608933 |
Copper electrodeposition in microelectronics |
Vincent Paneccasio, Jr., Richard Hurtubise, Paul Figura |
2013-12-17 |
| 8388824 |
Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers |
Vincent Paneccasio, Jr., Richard Hurtubise, Qingyun Chen |
2013-03-05 |
| 8002962 |
Copper electrodeposition in microelectronics |
Vincent Paneccasio, Jr., Paul Figura, Richard Hurtubise |
2011-08-23 |
| 7998859 |
Surface preparation process for damascene copper deposition |
Qingyun Chen, Vincent Paneccasio, Jr., Richard Hurtubise, Joseph A. Abys |
2011-08-16 |
| 7968455 |
Copper deposition for filling features in manufacture of microelectronic devices |
Richard Hurtubise, Vincent Paneccasio, Jr., Qingyun Chen |
2011-06-28 |
| 7815786 |
Copper electrodeposition in microelectronics |
Vincent Paneccasio, Jr., Paul Figura, Richard Hurtubise |
2010-10-19 |
| 7670950 |
Copper metallization of through silicon via |
Thomas B. Richardson, Yun Zhang, Chen Wang, Vincent Paneccasio, Jr., Cai Wang +2 more |
2010-03-02 |
| 7316772 |
Defect reduction in electrodeposited copper for semiconductor applications |
John Commander, Richard Hurtubise, Vincent Paneccasio, Jr., Kshama Jirage |
2008-01-08 |
| 7303992 |
Copper electrodeposition in microelectronics |
Vincent Paneccasio, Jr., Paul Figura, Richard Hurtubise |
2007-12-04 |
| 7241371 |
Additive-assisted, cerium-based, corrosion-resistant e-coating |
James O. Stoffer, Thomas J. O'Keefe, Eric L. Morris, Scott Hayes, Pu Yu |
2007-07-10 |
| 7048807 |
Cerium-based spontaneous coating process for corrosion protection of aluminum alloys |
James O. Stoffer, Thomas J. O'Keefe, Matthew J. O'Keefe, Eric L. Morris, Scott Hayes +3 more |
2006-05-23 |
| 6818116 |
Additive-assisted cerium-based electrolytic coating process for corrosion protection of aluminum alloys |
James O. Stoffer, Thomas J. O'Keefe, Eric L. Morris, Scott Hayes, Paul Yu +1 more |
2004-11-16 |
| 5932083 |
Electrodeposition of cerium-based coatings for corrosion protection of aluminum alloys |
James O. Stoffer, Thomas J. O'Keefe, Eric L. Morris, Pu Yu, Srinivas Pravin Sitaram |
1999-08-03 |