Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10541140 | Process for filling vias in the microelectronics | Thomas B. Richardson, Joseph A. Abys, Wenbo Shao, Vincent Paneccasio, Jr., Cai Wang +2 more | 2020-01-21 |
| 10221496 | Copper filling of through silicon vias | Thomas B. Richardson, Wenbo Shao, Xuan Lin, Cai Wang, Vincent Paneccasio, Jr. +3 more | 2019-03-05 |
| 10103029 | Process for filling vias in the microelectronics | Thomas B. Richardson, Joseph A. Abys, Wenbo Shao, Vincent Paneccasio, Jr., Cai Wang +2 more | 2018-10-16 |
| 7670950 | Copper metallization of through silicon via | Thomas B. Richardson, Yun Zhang, Vincent Paneccasio, Jr., Cai Wang, Xuan Lin +2 more | 2010-03-02 |