Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12369425 | Method for preparing electrode film layer on surface of solar cell substrate | Ping Xiao, Jiguang Xiong, Zhiguo Zhao, Jialiang Liu, Mengjie LI +7 more | 2025-07-22 |
| 12281403 | Method for electroplating nanograined copper | Peipei Dong, Jing Wang | 2025-04-22 |
| 11802345 | Metal material with thermodynamic anisotropy and a method of preparing the same | Jing Wang, Peipei Dong, Xingxing Zhang | 2023-10-31 |
| 11767435 | Anti-reflection coating composition and use thereof | Jiaqi Zhao, Fanjie Xu | 2023-09-26 |
| 11613824 | Bamboo-like copper crystal particles having a highly preferred orientation | Jing Wang, Zifang Zhu, Tao Ma, Luming Chen | 2023-03-28 |
| 11286544 | Calcium-bearing magnesium and rare earth element alloy and method for manufacturing the same | Haitao Jiang, Qiang Kang, Peng Liu, Peng Dong, Zhe Xu +1 more | 2022-03-29 |
| 11242607 | Metal material with thermodynamic anisotropy and a method of preparing the same | Jing Wang, Peipei Dong, Xingxing Zhang | 2022-02-08 |
| 10683275 | Leveler, leveler composition and method for electrodeposition of metals in microelectronics | Tao Ma, Peipei Dong, Zifang Zhu, Chen Chen | 2020-06-16 |
| 10604857 | Copper crystal particles having a highly preferred orientation and a preparation method thereof | Jing Wang, Zifang Zhu, Tao Ma, Luming Chen | 2020-03-31 |
| 10323015 | Leveler, leveler composition and method for electrodeposition of metals in microelectronics | Tao Ma, Peipei Dong, Zifang Zhu, Chen Chen | 2019-06-18 |
| 10315927 | Methods and processes of preparing aluminum hydroxide and aluminum oxide | Bing Zhao, Yinsheng Wang, Jinshan Zhang | 2019-06-11 |
| 10221496 | Copper filling of through silicon vias | Thomas B. Richardson, Wenbo Shao, Xuan Lin, Cai Wang, Vincent Paneccasio, Jr. +3 more | 2019-03-05 |
| 9920023 | Leveling composition and method for electrodeposition of metals in microelectronics | Tao Ma, Peipei Dong | 2018-03-20 |
| 9773962 | Formation of bismuth strontium calcium copper oxide superconductors | Justin Schwartz, Carl Koch, Xiaotao Liu | 2017-09-26 |
| 9643857 | Methods of preparing high purity aluminum hydroxide and high purity aluminum oxide | Bing Zhao, Yinsheng Wang, Jinshan Zhang | 2017-05-09 |
| 9551081 | Leveling composition and method for electrodeposition of metals in microelectronics | Tao Ma, Peipei Dong | 2017-01-24 |
| 9145305 | Methods and processes of preparing aluminum oxide | Bing Zhao, Yinsheng Wang, Jinshan Zhang | 2015-09-29 |
| 7713859 | Tin-silver solder bumping in electronics manufacture | Thomas B. Richardson, Marlies Kleinfeld, Christian Rietmann, Igor Zavarine, Ortrud Steinius +1 more | 2010-05-11 |
| 7670950 | Copper metallization of through silicon via | Thomas B. Richardson, Chen Wang, Vincent Paneccasio, Jr., Cai Wang, Xuan Lin +2 more | 2010-03-02 |
| 6982030 | Reduction of surface oxidation during electroplating | Robert Schetty, Kilnam Hwang | 2006-01-03 |
| 6808614 | Electroplating solution for high speed plating of tin-copper solder | Oscar Khaselev, Igor Zavarine | 2004-10-26 |
| 6730209 | Solder electroplating bath including brighteners having reduced volatility | Joseph A. Abys, Frank Stanley Humiec, Kenneth J. Murski | 2004-05-04 |
| 6726827 | Electroplating solution for high speed plating of tin-bismuth solder | Oscar Khaselev, Igor Zavarine | 2004-04-27 |
| 6342148 | Tin electroplating bath | See Hong Chiu | 2002-01-29 |
| 6267863 | Electroplating solution for electroplating lead and lead/tin alloys | Joseph A. Abys, Kenneth J. Murski | 2001-07-31 |