Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388042 | Solder material and method for die attachment | Angelo Gulino, Bogdan BANKIEWICZ, Anna Lifton, Michael T. Marczi, Girard Sidone +2 more | 2025-08-12 |
| 12246376 | Sinter-ready silver films | Matthew James Siebenhuhner, Monnir Boureghda, Mike Marczi, Carl J. Bilgrien | 2025-03-11 |
| 11842974 | Solder material and method for die attachment | Angelo Gulino, Bogdan BANKIEWICZ, Anna Lifton, Michael T. Marczi, Girard Sidone +2 more | 2023-12-12 |
| 11699632 | Methods for attachment and devices produced using the methods | Monnir Boureghda, Nitin Desai, Anna Lifton, Michael T. Marczi, Bawa Singh | 2023-07-11 |
| 11390054 | Composite and multilayered silver films for joining electrical and mechanical components | Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh | 2022-07-19 |
| 11289447 | Method for die and clip attachment | Eef Boschman | 2022-03-29 |
| 11162007 | Sintering paste | Shamik Ghosal, Ranjit Pandher, Ravi Bhatkal, Rahul Raut, Bawa Singh +11 more | 2021-11-02 |
| 10905041 | Methods for attachment and devices produced using the methods | Monnir Boureghda, Nitin Desai, Anna Lifton, Michael T. Marczi, Bawa Singh | 2021-01-26 |
| 10710336 | Composite and multilayered silver films for joining electrical and mechanical components | Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh | 2020-07-14 |
| 10535628 | Sintering materials and attachment methods using same | Bin Mo, Michael T. Marczi, Bawa Singh, Monnir Boureghda | 2020-01-14 |
| 10465295 | Jettable inks for solar cell and semiconductor fabrication | Steven Dane Prokopiak, Ellen S. Tormey, Michael T. Marczi, Bawa Singh | 2019-11-05 |
| 10462908 | Conductive patterns and methods of using them | Nitin Desai, Michael T. Marczi, Bawa Singh | 2019-10-29 |
| 10259980 | Sintering powder | Shamik Ghosal, Ranjit Pandher, Ravi Bhatkal, Rahul Raut, Bawa Singh +11 more | 2019-04-16 |
| 9615463 | Method for producing a high-aspect ratio conductive pattern on a substrate | Nitin Desai, Michael T. Marczi, Bawa Singh | 2017-04-04 |
| 9362424 | Electrical contacts | Nitin Desai, Michael T. Marczi, Bawa Singh | 2016-06-07 |
| 9217088 | Particles and inks and films using them | Sachin Parashar, Siuli Sarkar, Brian G. Lewis, Michael T. Marczi, Bawa Singh +2 more | 2015-12-22 |
| 8597548 | Solvent systems for metals and inks | Nitin Desai, Michael T. Marczi, Bawa Singh | 2013-12-03 |
| 8555491 | Methods of attaching a die to a substrate | Monnir Boureghda, Nitin Desai, Anna Lifton, Michael T. Marczi, Bawa Singh | 2013-10-15 |
| 8312623 | Methods for producing electrical conductors | Nitin Desai, Michael T. Marczi, Bawa Singh | 2012-11-20 |
| 8304062 | Electrical conductors and methods of making and using them | Nitin Desai, Supriya Deverajen, Michael T. Marczi, Bawa Singh | 2012-11-06 |
| 8252417 | Metallic particles for electrokinetic or electrostatic deposition | Brian G. Lewis | 2012-08-28 |
| 7968008 | Particles and inks and films using them | Sachin Parashar, Siuli Sarkar, Brian G. Lewis, Michael T. Marczi, Bawa Singh +2 more | 2011-06-28 |
| 7678255 | Mask and method for electrokinetic deposition and patterning process on substrates | Brian G. Lewis, Michael T. Marczi, Bawa Singh | 2010-03-16 |
| 7413805 | Preparation of metallic particles for electrokinetic or electrostatic deposition | Brian G. Lewis | 2008-08-19 |
| 6808614 | Electroplating solution for high speed plating of tin-copper solder | Igor Zavarine, Yun Zhang | 2004-10-26 |