Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7713859 | Tin-silver solder bumping in electronics manufacture | Thomas B. Richardson, Marlies Kleinfeld, Christian Rietmann, Ortrud Steinius, Yun Zhang +1 more | 2010-05-11 | |
| 6808614 | Electroplating solution for high speed plating of tin-copper solder | Oscar Khaselev, Yun Zhang | 2004-10-26 | $15,212,000 |
| 6726827 | Electroplating solution for high speed plating of tin-bismuth solder | Oscar Khaselev, Yun Zhang | 2004-04-27 | $16,931,000 |