Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10508207 | Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrate | Andreas R. Glöckner | 2019-12-17 |
| 10021782 | Composition and method for the deposition of conductive polymers on dielectric substrates | Jean Rasmussen | 2018-07-10 |
| 7713859 | Tin-silver solder bumping in electronics manufacture | Thomas B. Richardson, Marlies Kleinfeld, Igor Zavarine, Ortrud Steinius, Yun Zhang +1 more | 2010-05-11 |