Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7713859 | Tin-silver solder bumping in electronics manufacture | Thomas B. Richardson, Christian Rietmann, Igor Zavarine, Ortrud Steinius, Yun Zhang +1 more | 2010-05-11 |
| 6821323 | Process for the non-galvanic tin plating of copper or copper alloys | Jane Bell, Joachim Heyer, Jurgen Hupe, Ingo Kalker | 2004-11-23 |
| 5981793 | Slightly water-soluble metal salts, a process for the preparation thereof, and the use thereof as gloss additives in the electrolytic deposition of metals | Eberhard Knaak, Joachim Heyer, Christel van Wijngaarden | 1999-11-09 |