Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7815785 | Direct metallization of electrically non-conductive polyimide substrate surfaces | Walter Kronenberg | 2010-10-19 |
| 6821323 | Process for the non-galvanic tin plating of copper or copper alloys | Jane Bell, Joachim Heyer, Ingo Kalker, Marlies Kleinfeld | 2004-11-23 |
| 6589593 | Method for metal coating of substrates | Sabine Fix, Ortrud Steinius | 2003-07-08 |
| 6576111 | Process for the copper plating of substrates | Walter Kronenberg, Eugen Breitkreuz, Ulrich Schmergel | 2003-06-10 |
| 6007866 | Process and device for producing through-connected printed circuit boards and multilayered printed circuit boards | Sabine Fix | 1999-12-28 |
| 5373629 | Through-hole plate printed circuit board with resist and process for manufacturing same | Walter Kronenberg | 1994-12-20 |
| 5194313 | Through-hole plated printed circuit board and process for manufacturing same | Walter Kronenberg | 1993-03-16 |
| 5145572 | Process for manufacturing through-hole contacting plated printed circuit | Herbert Iwan | 1992-09-08 |
| 4990395 | Electrically conductive copper layers and process for preparing same | Frank Sonnenschein, Herbert Breidenbach | 1991-02-05 |
| 4750976 | Electrically conductive copper layers and process for preparing same | Frank Sonnenschein, Herbert Breidenbach | 1988-06-14 |