Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7713859 | Tin-silver solder bumping in electronics manufacture | Thomas B. Richardson, Marlies Kleinfeld, Christian Rietmann, Igor Zavarine, Yun Zhang +1 more | 2010-05-11 |
| 6589593 | Method for metal coating of substrates | Jurgen Hupe, Sabine Fix | 2003-07-08 |