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Low pressure sintering powder |
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Multilayered metal nano and micron particles |
Shamik Ghoshal, Remya Chandran, Sutapa Mukherjee, Ranjit Pandher, Bawa Singh |
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High reliability lead-free solder alloy |
Morgana De Avila Ribas, Suresh Telu, Pritha Choudhury, Anil Kumar |
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Engineered polymer-based electronic materials |
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Stretchable interconnects for flexible electronic surfaces |
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Metal recovery |
Narahari Pujari, Bawa Singh, Daniel Goswami |
2019-12-03 |
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Low temperature high reliability alloy for solder hierarchy |
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Nirmalya Kumar Chaki, Poulami Sengupta Roy, Sutapa Mukherjee |
2018-11-20 |
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2017-10-31 |
| 9786629 |
Dual-side reinforcement flux for encapsulation |
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