| 12497532 |
Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures |
Nirmalya Kumar Chaki, Chetan Pravinchandra Shah, Barun Das, Supriya Devarajan, Rahul Raut +5 more |
2025-12-16 |
| 12278022 |
Stretchable interconnects for flexible electronic surfaces |
Narahari Pujari, Bawa Singh, Ravi Bhatkal, Anubhav Rustogi |
2025-04-15 |
| 12233483 |
Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications |
Rahul Raut, Nirmalyakumar Chaki, Bawa Singh, Ranjit Pandher |
2025-02-25 |
| 12115602 |
Lead-free solder compositions |
Ranjit Pandher, Niveditha NAGARAJAN, Anil Kumar, Morgana De Avila Ribas, Gyan Dutt +1 more |
2024-10-15 |
| 12113039 |
Low pressure sintering powder |
Shamik Ghoshal, Nirmalya Kumar Chaki, Poulami Sengupta Roy, Anubhav Rustogi |
2024-10-08 |
| 12084583 |
Dielectric ink composition |
Narahari Pujari, Jayaprakash Sundaramurthy, Ravindra M. Bhatkal |
2024-09-10 |
| 11929341 |
Nano copper paste and film for sintered die attach and similar applications |
Shamik Ghosal, Remya Chandran, Venodh Manoharan, Bawa Singh, Rahul Raut |
2024-03-12 |
| 11830640 |
Stretchable interconnects for flexible electronic surfaces |
Narahari Pujari, Bawa Singh, Ravi Bhatkal, Anubhav Rustogi |
2023-11-28 |
| 11624000 |
Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures |
Nirmalya Kumar Chaki, Chetan Pravinchandra Shah, Barun Das, Supriya Devarajan, Rahul Raut +5 more |
2023-04-11 |
| 11411150 |
Advanced solder alloys for electronic interconnects |
Morgana de Avila Ribas, Pritha Choudhury, Ranjit Pandher, Nicholas G. Herrick, Amit J. Patel +2 more |
2022-08-09 |
| 11389865 |
Sintering materials and attachment methods using same |
Shamik Ghoshal, V. Sathish Kumar, Pavan Vishwanath, Ranjit Pandher, Remya Chandran +3 more |
2022-07-19 |
| 11193031 |
Dielectric ink composition |
Narahari Pujari, Jayaprakash Sundaramurthy, Ravindra M. Bhatkal |
2021-12-07 |
| 11162007 |
Sintering paste |
Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut +11 more |
2021-11-02 |
| 11139089 |
Stretchable interconnects for flexible electronic surfaces |
Narahari Pujari, Bawa Singh, Ravi Bhatkal, Anubhav Rustogi |
2021-10-05 |
| 11090768 |
Lead-free and antimony-free tin solder reliable at high temperatures |
Pritha Choudhury, Morgana de Avila Ribas, Sutapa Mukherjee, Anil Kumar, Ranjit Pandher +2 more |
2021-08-17 |
| 10998284 |
Low pressure sintering powder |
Shamik Ghoshal, Nirmalya Kumar Chaki, Poulami Sengupta Roy, Anubhav Rustogi |
2021-05-04 |
| 10894302 |
Multilayered metal nano and micron particles |
Shamik Ghoshal, Remya Chandran, Sutapa Mukherjee, Ranjit Pandher, Bawa Singh |
2021-01-19 |
| 10821557 |
High reliability lead-free solder alloy |
Morgana De Avila Ribas, Suresh Telu, Pritha Choudhury, Anil Kumar |
2020-11-03 |
| 10682732 |
Engineered polymer-based electronic materials |
Ramakrishna Hosur Venkatagiriyappa, Morgana de Avila Ribas, Barun Das, Harish Hanchina Siddappa, Sutapa Mukherjee +3 more |
2020-06-16 |
| 10672531 |
Stretchable interconnects for flexible electronic surfaces |
Narahari Pujari, Bawa Singh, Ravi Bhatkal, Anubhav Rustogi |
2020-06-02 |
| 10494696 |
Metal recovery |
Narahari Pujari, Bawa Singh, Daniel Goswami |
2019-12-03 |
| 10322471 |
Low temperature high reliability alloy for solder hierarchy |
Pritha Choudhury, Morgana de Avila Ribas, Sutapa Mukherjee, Ranjit Pandher, Ravindra M. Bhatkal +1 more |
2019-06-18 |
| 10259980 |
Sintering powder |
Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut +11 more |
2019-04-16 |
| 10130995 |
Method for manufacturing metal powder |
Nirmalya Kumar Chaki, Poulami Sengupta Roy, Sutapa Mukherjee |
2018-11-20 |
| 9802275 |
Rosin-free thermosetting flux formulations |
Morgana De Avila Ribas, Rahul Raut, Traian Cornel Cucu, Shu Tai Yong, Ramakrishna Hosur Katagiriyappa |
2017-10-31 |