Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Nano copper paste and film for sintered die attach and similar applications

Nano copper paste and film for sintered die attach and similar applications

US Patent 11929341 · Granted Mar 12, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Graphene enhanced and engineered materials for membrane touch switch and other f2025
Graphene enhanced and engineered materials for membrane touch switch and other f2025
Soft-chew tablet pharmaceutical formulations2025
Stretchable interconnects for flexible electronic surfaces2025
Stretchable interconnects for flexible electronic surfaces2025
Low temperature soldering solutions for polymer substrates, printed circuit boar2025
Low temperature soldering solutions for polymer substrates, printed circuit boar2025
Low temperature soldering solutions for polymer substrates, printed circuit boar2025
Applications of engineered graphene2024
Applications of engineered graphene2024
Applications of engineered graphene2024
Lead-free solder compositions2024