Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12281403 | Method for electroplating nanograined copper | Yun Zhang, Jing Wang | 2025-04-22 |
| 11802345 | Metal material with thermodynamic anisotropy and a method of preparing the same | Yun Zhang, Jing Wang, Xingxing Zhang | 2023-10-31 |
| 11242607 | Metal material with thermodynamic anisotropy and a method of preparing the same | Yun Zhang, Jing Wang, Xingxing Zhang | 2022-02-08 |
| 10683275 | Leveler, leveler composition and method for electrodeposition of metals in microelectronics | Yun Zhang, Tao Ma, Zifang Zhu, Chen Chen | 2020-06-16 |
| 10323015 | Leveler, leveler composition and method for electrodeposition of metals in microelectronics | Yun Zhang, Tao Ma, Zifang Zhu, Chen Chen | 2019-06-18 |
| 9920023 | Leveling composition and method for electrodeposition of metals in microelectronics | Yun Zhang, Tao Ma | 2018-03-20 |
| 9551081 | Leveling composition and method for electrodeposition of metals in microelectronics | Yun Zhang, Tao Ma | 2017-01-24 |