Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7270734 | Near neutral pH cleaning/activation process to reduce surface oxides on metal surfaces prior to electroplating | Kilbnam Hwang | 2007-09-18 |
| 6982030 | Reduction of surface oxidation during electroplating | Yun Zhang, Kilnam Hwang | 2006-01-03 |
| 6860981 | Minimizing whisker growth in tin electrodeposits | Winnie Vickers | 2005-03-01 |
| 6531046 | Seed layer repair method | Denis Morrissey, David Merricks, Leon Barstad, Eugene N. Step, Jeffrey M. Calvert +4 more | 2003-03-11 |
| 6444110 | Electrolytic copper plating method | Leon Barstad, James Rychwalski, Mark Lefebvre, Stephane Menard, James L. Martin +1 more | 2002-09-03 |
| 4994155 | High speed tin, lead or tin/lead alloy electroplating | Michael P. Toben, Neil D. Brown, David J. Esterl | 1991-02-19 |
| 4880507 | Tin, lead or tin/lead alloy electrolytes for high speed electroplating | Michael P. Toben, Neil D. Brown, David J. Esterl | 1989-11-14 |