Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10428436 | Indium electroplating compositions containing amine compounds and methods of electroplating indium | Yi Qin, Kristen Flajslik | 2019-10-01 |
| 10100421 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds | Matthew Thorseth, Zuhra I. Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek +1 more | 2018-10-16 |
| 10104782 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides | Matthew Thorseth, Zuhra I. Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek +1 more | 2018-10-16 |
| 10006136 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds | Matthew Thorseth, Zuhra I. Niazimbetova, Yi Qin, Julia Woertink, Julia Kozhukh +1 more | 2018-06-26 |
| 9932684 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides | Matthew Thorseth, Zuhra I. Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek +1 more | 2018-04-03 |
| 9809892 | Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium | Yi Qin, Kristen Flajslik | 2017-11-07 |
| 9809891 | Plating method | Matthew Thorseth, Mark Scalisi, Luis A. Gomez, Bryan LIEB, Rebecca Hazebrouck | 2017-11-07 |
| 9365943 | Method of electroplating uniform copper layers | Elie H. Najjar, Leon Barstad, Michael P. Toben | 2016-06-14 |
| 8956523 | Metal plating compositions and methods | Erik Reddington, Gonzalo Urrutia Desmaison, Zukra I. Niazimbetova, Donald E. Cleary | 2015-02-17 |
| 8716824 | Article having electrically conductive and selectively passivated patterns | Jitendra S. Goela, Michael A. Pickering, Neil D. Brown, Angelo Chirafisi, Jamie L. Triba | 2014-05-06 |
| 8337688 | Metal plating compositions | Erik Reddington, Gonzalo Urrutia Desmaison, Zukra I. Niazimbetova, Donald E. Cleary | 2012-12-25 |
| 8329018 | Metal plating compositions and methods | Erik Reddington, Gonzalo Urrutia Desmaison, Zukra I. Niazimbetova, Donald E. Cleary | 2012-12-11 |
| 8198120 | Optical article | Jitendra S. Goela, Michael A. Pickering, Neil D. Brown, Angelo Chirafisi, Jamie L. Triba | 2012-06-12 |
| 8048284 | Metal plating compositions | Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary | 2011-11-01 |
| 8012334 | Metal plating compositions and methods | Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary | 2011-09-06 |
| 6689711 | Methods of producing oxygen reduction catalyst | — | 2004-02-10 |
| 6660153 | Seed layer repair bath | David Merricks, Denis Morrissey, Martin W. Bayes, James G. Shelnut, Donald E. Storjohann | 2003-12-09 |
| 6660154 | Seed layer | David Merricks, Denis Morrissey, Martin W. Bayes, James G. Shelnut, Donald E. Storjohann | 2003-12-09 |
| 6531046 | Seed layer repair method | Denis Morrissey, David Merricks, Leon Barstad, Eugene N. Step, Jeffrey M. Calvert +4 more | 2003-03-11 |
| 6444110 | Electrolytic copper plating method | Leon Barstad, James Rychwalski, Stephane Menard, James L. Martin, Robert Schetty +1 more | 2002-09-03 |