Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10988852 | Method of electroplating copper into a via on a substrate from an acid copper electroplating bath | Matthew Thorseth, Corey Ciullo | 2021-04-27 |
| 10508349 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides | Ravi Pokhrel, Matthew Thorseth, James Byrnes, Zuhra I. Niazimbetova, Joanna Dziewiszek | 2019-12-17 |
| 10190228 | Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features | Matthew Thorseth, Rebecca Hazebrouck, Zuhra I. Niazimbetova, Joanna Dziewiszek | 2019-01-29 |
| 9809891 | Plating method | Matthew Thorseth, Luis A. Gomez, Bryan LIEB, Rebecca Hazebrouck, Mark Lefebvre | 2017-11-07 |