Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10508349 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides | Ravi Pokhrel, Matthew Thorseth, James Byrnes, Mark Scalisi, Zuhra I. Niazimbetova | 2019-12-17 |
| 10508357 | Method of filling through-holes to reduce voids and other defects | Nagarajan Jayaraju, Leon Barstad, Zuhra I. Niazimbetova | 2019-12-17 |
| 10190228 | Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features | Matthew Thorseth, Rebecca Hazebrouck, Mark Scalisi, Zuhra I. Niazimbetova | 2019-01-29 |
| 10100421 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds | Matthew Thorseth, Zuhra I. Niazimbetova, Yi Qin, Julia Woertink, Erik Reddington +1 more | 2018-10-16 |
| 10104782 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides | Matthew Thorseth, Zuhra I. Niazimbetova, Yi Qin, Julia Woertink, Erik Reddington +1 more | 2018-10-16 |
| 9932684 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides | Matthew Thorseth, Zuhra I. Niazimbetova, Yi Qin, Julia Woertink, Erik Reddington +1 more | 2018-04-03 |