Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10508357 | Method of filling through-holes to reduce voids and other defects | Nagarajan Jayaraju, Zuhra I. Niazimbetova, Joanna Dziewiszek | 2019-12-17 |
| 10512174 | Method of filling through-holes to reduce voids and other defects | Nagarajan Jayaraju | 2019-12-17 |
| 10154598 | Filling through-holes | Nagarajan Jayaraju, Elie H. Najjar | 2018-12-11 |
| 9598787 | Method of filling through-holes | Nagarajan Jayaraju, Elie H. Najjar | 2017-03-21 |
| 9365943 | Method of electroplating uniform copper layers | Elie H. Najjar, Mark Lefebvre, Michael P. Toben | 2016-06-14 |
| 7384535 | Bath analysis | Wade Sonnenberg, Raymond Cruz, Gary Hamm, Mark J. Kapeckas, Erik Reddington +3 more | 2008-06-10 |
| 6911068 | Plating bath and method for depositing a metal layer on a substrate | Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley | 2005-06-28 |
| 6827839 | Plating bath analysis | Wade Sonnenberg, Mark J. Kapeckas, David L. Jacques, Raymond Cruz, Elie H. Najjar +2 more | 2004-12-07 |
| 6773573 | Plating bath and method for depositing a metal layer on a substrate | David Gabe, Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg +1 more | 2004-08-10 |
| 6736954 | Plating bath and method for depositing a metal layer on a substrate | Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley | 2004-05-18 |
| 6652731 | Plating bath and method for depositing a metal layer on a substrate | Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley | 2003-11-25 |
| 6531046 | Seed layer repair method | Denis Morrissey, David Merricks, Eugene N. Step, Jeffrey M. Calvert, Robert Schetty +4 more | 2003-03-11 |
| 6444110 | Electrolytic copper plating method | James Rychwalski, Mark Lefebvre, Stephane Menard, James L. Martin, Robert Schetty +1 more | 2002-09-03 |