Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9365943 | Method of electroplating uniform copper layers | Elie H. Najjar, Mark Lefebvre, Leon Barstad | 2016-06-14 |
| 9303207 | Texturing of monocrystalline semiconductor substrates to reduce incident light reflectance | Robert K. Barr, Corey O'Connor | 2016-04-05 |
| 9228092 | Electrochemically deposited indium composites | Nathaniel E. Brese, Edit Szocs, Felix J. Schwager, Martin W. Bayes | 2016-01-05 |
| 9206519 | Indium compositions | Edit Szocs, Felix J. Schwager, Thomas Gaethke, Nathaniel E. Brese | 2015-12-08 |
| 9145616 | Method of preventing silver tarnishing | Adolphe FOYET, Wan Zhang-Beglinger, Jonas Guebey | 2015-09-29 |
| 9114594 | High temperature resistant silver coated substrates | Wan Zhang-Beglinger, Margit Clauss | 2015-08-25 |
| 8920623 | Method for replenishing tin and its alloying metals in electrolyte solutions | Yu Luo, Neil D. Brown | 2014-12-30 |
| 8765001 | Texturing of monocrystalline semiconductor substrates to reduce incident light reflectance | Robert K. Barr, Corey O'Connor | 2014-07-01 |
| 8585885 | Electrochemically deposited indium composites | Nathaniel E. Brese, Edit Szocs, Felix J. Schwager, Martin W. Bayes | 2013-11-19 |
| 8460533 | Indium compositions | Edit Szocs, Felix J. Schwager, Thomas Gaethke, Nathaniel E. Brese | 2013-06-11 |
| 7968444 | Lead-free tin alloy electroplating compositions and methods | Yu Luo, Neil D. Brown | 2011-06-28 |
| 7695605 | Tin plating method | Keith J. Whitlaw, Andre Egli, Jeffrey N. Crosby, Craig Robinson | 2010-04-13 |
| 7357853 | Electroplating composite substrates | Neil D. Brown, Angelo Chirafisi | 2008-04-15 |
| 6776828 | Plating composition | Miriana Kanzler | 2004-08-17 |
| 6444110 | Electrolytic copper plating method | Leon Barstad, James Rychwalski, Mark Lefebvre, Stephane Menard, James L. Martin +1 more | 2002-09-03 |
| 6383269 | Electroless gold plating solution and process | James L. Martin, Yasuo Ohta, Yasushi Takizawa, Haruki Enomoto | 2002-05-07 |
| 6210556 | Electrolyte and tin-silver electroplating process | Daniel C. Marcktell, Neil D. Brown, Colleen A. Doyle | 2001-04-03 |
| 5174887 | High speed electroplating of tinplate | George A. Federman, Donald W. Thomson, Neil D. Brown | 1992-12-29 |
| 4994155 | High speed tin, lead or tin/lead alloy electroplating | Neil D. Brown, David J. Esterl, Robert Schetty | 1991-02-19 |
| 4880507 | Tin, lead or tin/lead alloy electrolytes for high speed electroplating | Neil D. Brown, David J. Esterl, Robert Schetty | 1989-11-14 |
| 4741818 | Alkaline baths and methods for electrodeposition of palladium and palladium alloys | Fred I. Nobel, James L. Martin | 1988-05-03 |
| 4628165 | Electrical contacts and methods of making contacts by electrodeposition | Fred I. Nobel, James L. Martin | 1986-12-09 |
| 4622110 | Palladium plating | James L. Martin, John E. McCaskie | 1986-11-11 |
| 4545868 | Palladium plating | James L. Martin, John E. McCaskie | 1985-10-08 |