Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12351936 | Layered plating stack for improved contact resistance in corrosive environments | Suvrat Bhargava, Matthew Little, Rodney Ivan Martens, Bradley M. SCHULTZ | 2025-07-08 |
| 12027281 | Metallic structure with desired combinations of mechanical and electrical characteristics | Gokce Gulsoy, David Patrick Orris, David Bruce Sarraf, Chad William Morgan, Jevon Ryan Corban | 2024-07-02 |
| 11859092 | Printable non-curable thixotropic hot melt composition | Lei Wang, Ting Gao, Philip Singer, James Zeigler | 2024-01-02 |
| 11859093 | Printable non-curable thixotropic hot melt composition | Lei Wang, Ting Gao, Kenneth C. Seufer, Jr., Philip Singer, James Zeigler | 2024-01-02 |
| 11843153 | Use of enhanced performance ultraconductive copper materials in cylindrical configurations and methods of forming ultraconductive copper materials | Gokce Gulsoy, Ting Gao, David Bruce Sarraf, Chad William Morgan, Rodney Ivan Martens | 2023-12-12 |
| 11355872 | Mezzanine power pin for an electrical connector system | David Patrick Orris | 2022-06-07 |
| 9863044 | Method for electroless metallization | Maria Anna Rzeznik, Philip D. Knudsen, Xuesong Wang, Yuhsin Tsai | 2018-01-09 |
| 9783890 | Process for electroless plating and a solution used for the same | Dennis Kwok-Wai Yee, Michael Chi-Yung Tang, Ka Ming Yip, Chun-Man Chan, Hung Tat Chan +2 more | 2017-10-10 |
| 9499910 | Process for electroless plating and a solution used for the same | Dennis Kwok-Wai Yee, Michael Chi-Yung Tang, Ka Ming Yip, Chun-Man Chan, Hung Tat Chan +2 more | 2016-11-22 |
| 9228092 | Electrochemically deposited indium composites | Nathaniel E. Brese, Edit Szocs, Felix J. Schwager, Michael P. Toben | 2016-01-05 |
| 9102901 | Methods and compositions for removal of metal hardmasks | Deyan Wang, Peter Trefonas, III, Kathleen M. O'Connell | 2015-08-11 |
| 8961678 | Organic solderability preservative and method | Qin Tang, Kit Ho Tong, Chit Yiu Chan | 2015-02-24 |
| 8585885 | Electrochemically deposited indium composites | Nathaniel E. Brese, Edit Szocs, Felix J. Schwager, Michael P. Toben | 2013-11-19 |
| 6660153 | Seed layer repair bath | David Merricks, Denis Morrissey, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann | 2003-12-09 |
| 6660154 | Seed layer | David Merricks, Denis Morrissey, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann | 2003-12-09 |
| 6531046 | Seed layer repair method | Denis Morrissey, David Merricks, Leon Barstad, Eugene N. Step, Jeffrey M. Calvert +4 more | 2003-03-11 |
| 6372055 | Method for replenishing baths | Joseph Montano, Kimberly B. Wynja, Edward C. Couble | 2002-04-16 |
| 6261466 | Composition for circuit board manufacture | Peter W. Hinkley, John Cahalen, Peter Benson | 2001-07-17 |
| 6139762 | Methods for manufacture of electronic devices | Christopher P. Esposito, Takahiro Kobayashi, Masaki Kondoh | 2000-10-31 |
| 6054061 | Composition for circuit board manufacture | Peter W. Hinkley | 2000-04-25 |
| 5108786 | Method of making printed circuit boards | — | 1992-04-28 |
| 4717439 | Process for the treatment of copper oxide in the preparation of printed circuit boards | Juan Hajdu | 1988-01-05 |