Issued Patents All Time
Showing 1–25 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12398479 | Copper electroplating baths containing reaction products of amines, polyacrylamides and bisepoxoides | Weijing Lu, Lingli Duan, Zukhra I. Niazimbetova, Chen Chen | 2025-08-26 |
| 11761107 | Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones | Weijing Lu, Lingli Duan, Zukhra I. Niazimbetova, Chen Chen | 2023-09-19 |
| 11732374 | Reaction products of amine monomers and polymers containing saturated heterocyclic moieties as additives for electroplating baths | Lingli Duan, Chen Chen, Tong Sun, Zukhra I. Niazimbetova | 2023-08-22 |
| 10892802 | Metal plating compositions | Lingli Duan, Chen Chen, Shaoguang Feng, Zukhra I. Niazimbetova | 2021-01-12 |
| 10738388 | Copper electroplating baths containing compounds of reaction products of amines and polyacrylamides | Weijing Lu, Lingli Duan, Zukhra I. Niazimbetova, Chen Chen | 2020-08-11 |
| 10738039 | Metal plating compositions | Lingli Duan, Chen Chen, Shaoguang Feng, Zukhra I. Niazimbetova | 2020-08-11 |
| 10662541 | Copper electroplating baths containing reaction products of aminex, polyacrylamides and bisepoxides | Weijing Lu, Lingli Duan, Zukhra I. Niazimbetova, Chen Chen | 2020-05-26 |
| 10604858 | Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones | Weijing Lu, Lingli Duan, Zukhra I. Niazimbetova, Chen Chen | 2020-03-31 |
| 10604856 | Reaction products of amine monomers and polymers containing saturated heterocyclic moieties as additives for electroplating baths | Lingli Duan, Chen Chen, Tong Sun, Zukhra I. Niazimbetova | 2020-03-31 |
| 10590556 | Copper electroplating baths containing compounds of reaction products of amines and quinones | Weijing Lu, Lingli Duan, Zukhra I. Niazimbetova, Chen Chen | 2020-03-17 |
| 10435380 | Metal plating compositions | Lingli Duan, Chen Chen, Shaoguang Feng, Zukhra I. Niazimbetova | 2019-10-08 |
| 10196751 | Nitrogen containing polymers as levelers | Lingli Duan, Zuhra I. Niazimbetova, Chen Chen, Tong Sun | 2019-02-05 |
| 10201097 | Polymers containing benzimidazole moieties as levelers | Lingli Duan, Yang Li, Tong Sun, Shaoguang Feng, Chen Chen +1 more | 2019-02-05 |
| 10106512 | Metal plating compositions | Lingli Duan, Chen Chen, Shaoguang Feng, Zukhra I. Niazimbetova | 2018-10-23 |
| 10041182 | Reaction products of amino acids and epoxies | Zuhra I. Niazimbetova | 2018-08-07 |
| 9918389 | Electroless metallization of dielectrics with alkaline stable pyrazine derivative containing catalysts | Feng Liu | 2018-03-13 |
| 9914115 | Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds | Kristen M. Milum, Donald E. Cleary | 2018-03-13 |
| 9863044 | Method for electroless metallization | Philip D. Knudsen, Xuesong Wang, Martin W. Bayes, Yuhsin Tsai | 2018-01-09 |
| 9783903 | Additives for electroplating baths | Julia Kozhukh, Zuhra I. Niazimbetova | 2017-10-10 |
| 9783905 | Reaction products of amino acids and epoxies | Zuhra I. Niazimbetova | 2017-10-10 |
| 9725816 | Amino sulfonic acid based polymers for copper electroplating | Weijing Lu, Zuhra I. Niazimbetova | 2017-08-08 |
| 9611549 | Stable catalysts for electroless metallization | Feng Liu | 2017-04-04 |
| 9611560 | Sulfonamide based polymers for copper electroplating | Weijing Lu, Zuhra I. Niazimbetova | 2017-04-04 |
| 9597676 | Stable catalysts for electroless metallization | Feng Liu | 2017-03-21 |
| 9598786 | Amino sulfonic acid based polymers for copper electroplating | Weijing Lu, Zuhra I. Niazimbetova | 2017-03-21 |