| 8816463 |
Wafer-level packaged microelectronic imagers having interconnects formed through terminals |
Salman Akram, Warren M. Farnworth, William M. Hiatt |
2014-08-26 |
|
| 8641831 |
Non-chemical, non-optical edge bead removal process |
— |
2014-02-04 |
$7,661,000 |
| 8192555 |
Non-chemical, non-optical edge bead removal process |
— |
2012-06-05 |
$2,836,000 |
| 7994547 |
Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects |
Salman Akram |
2011-08-09 |
$2,316,000 |
| 7960829 |
Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates |
Alan G. Wood, Warren M. Farnworth, David R. Hembree, Sidney B. Rigg, William M. Hiatt +2 more |
2011-06-14 |
$3,660,000 |
| 7759800 |
Microelectronics devices, having vias, and packaged microelectronic devices having vias |
Sidney B. Rigg, Charles M. Watkins, Kyle K. Kirby, Salman Akram |
2010-07-20 |
$2,641,000 |
| 7730016 |
Identification of false ambiguous roots in a stack conservative garbage collector |
Robert H. Lee, Harlan Sexton |
2010-06-01 |
$24,426,000 |
| 7713841 |
Methods for thinning semiconductor substrates that employ support structures formed on the substrates |
Alan G. Wood, Warren M. Farnworth, David R. Hembree, Sidney B. Rigg, William M. Hiatt +2 more |
2010-05-11 |
$4,723,000 |
| 7709776 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, James M. Wark +4 more |
2010-05-04 |
|
| 7629250 |
Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies |
Charles M. Watkins |
2009-12-08 |
$4,723,000 |
| 7615119 |
Apparatus for spin coating semiconductor substrates |
— |
2009-11-10 |
$7,986,000 |
| 7583358 |
Systems and methods for retrieving residual liquid during immersion lens photolithography |
— |
2009-09-01 |
$7,726,000 |
| 7579684 |
Methods for packing microfeature devices and microfeature devices formed by such methods |
Charles M. Watkins |
2009-08-25 |
$6,037,000 |
| 7575999 |
Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies |
Charles M. Watkins |
2009-08-18 |
$5,074,000 |
| 7521296 |
Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material |
Alan G. Wood, Warren M. Farnworth, Charles M. Watkins |
2009-04-21 |
$3,996,000 |
| 7504615 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, James M. Wark +4 more |
2009-03-17 |
|
| 7488618 |
Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same |
Alan G. Wood, Warren M. Farnworth, Charles M. Watkins |
2009-02-10 |
$1,650,000 |
| 7489020 |
Semiconductor wafer assemblies |
— |
2009-02-10 |
$1,650,000 |
| 7442643 |
Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials |
Alan G. Wood, Warren M. Farnworth, Charles M. Watkins |
2008-10-28 |
$1,200,000 |
| 7435620 |
Low temperature methods of forming back side redistribution layers in association with through wafer interconnects |
Salman Akram |
2008-10-14 |
$1,624,000 |
| 7419852 |
Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies |
Salman Akram |
2008-09-02 |
$1,912,000 |
| 7419841 |
Microelectronic imagers and methods of packaging microelectronic imagers |
Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Kyle K. Kirby, James M. Wark +4 more |
2008-09-02 |
$1,912,000 |
| 7413979 |
Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices |
Sidney B. Rigg, Charles M. Watkins, Kyle K. Kirby, Salman Akram |
2008-08-19 |
$1,561,000 |
| 7376942 |
Method of managing memory for class variables |
Harlan Sexton, David Unietis |
2008-05-20 |
$70,873,000 |
| 7341881 |
Methods of packaging and testing microelectronic imaging devices |
Charles M. Watkins, David R. Hembree, Salman Akram |
2008-03-11 |
$3,016,000 |
