Issued Patents All Time
Showing 25 most recent of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424517 | Monolithic conductive cylinder in a semiconductor device and associated methods | Wei Zhou, Bret K. Street, Kunal R. Parekh | 2025-09-23 |
| 12424516 | Monolithic conductive column in a semiconductor device and associated methods | Wei Zhou, Bret K. Street, Kunal R. Parekh | 2025-09-23 |
| 12381131 | Front end of line interconnect structures and associated systems and methods | Kunal R. Parekh | 2025-08-05 |
| 12368131 | Embedded nanoparticles for on-die thermal enhancement of hybrid bonding and associated systems and methods | Bang-Ning Hsu, Byung Hoon Moon | 2025-07-22 |
| 12368096 | Microelectronic devices with through-substrate interconnects and associated methods of manufacturing | Kunal R. Parekh, Sarah A. Niroumand | 2025-07-22 |
| 12334448 | Front end of line interconnect structures and associated systems and methods | Kunal R. Parekh | 2025-06-17 |
| 12334469 | Piezoelectric materials for on-die thermal enhancement of hybrid bonding and associated systems and methods | Byung Hoon Moon | 2025-06-17 |
| 12308348 | Multi-height interconnect structures and associated systems and methods | — | 2025-05-20 |
| 12300570 | Grindable heat sink for multiple die packaging | Wei Zhou, Bret K. Street | 2025-05-13 |
| 12191162 | Semiconductor device assembly with pillar array | Owen R. Fay, Akshay N. Singh | 2025-01-07 |
| 12183716 | Monolithic conductive columns in a semiconductor device and associated methods | Wei Zhou, Bret K. Street, Kunal R. Parekh | 2024-12-31 |
| 12107050 | Front end of line interconnect structures and associated systems and methods | Kunal R. Parekh | 2024-10-01 |
| 12074094 | Monolithic conductive column in a semiconductor device and associated methods | Wei Zhou, Bret K. Street, Kunal R. Parekh | 2024-08-27 |
| 12046559 | Semiconductor memory stacks connected to processing units and associated systems and methods | — | 2024-07-23 |
| 11978656 | Semiconductor with through-substrate interconnect | Kunal R. Parekh | 2024-05-07 |
| 11973062 | High density pillar interconnect conversion with stack to substrate connection | Owen R. Fay, Akshay N. Singh | 2024-04-30 |
| 11942444 | Semiconductor interconnect structures with vertically offset bonding surfaces, and associated systems and methods | — | 2024-03-26 |
| 11942428 | Inductors with through-substrate via cores | — | 2024-03-26 |
| 11862569 | Front end of line interconnect structures and associated systems and methods | Kunal R. Parekh | 2024-01-02 |
| 11823977 | Semiconductor devices with back-side coils for wireless signal and power coupling | — | 2023-11-21 |
| 11817305 | Front end of line interconnect structures and associated systems and methods | Kunal R. Parekh | 2023-11-14 |
| 11776926 | Combination-bonded die pair packaging and associated systems and methods | Bret K. Street | 2023-10-03 |
| 11769738 | Apparatuses exhibiting enhanced stress resistance and planarity, and related microelectronic devices and memory devices | Chao Wang | 2023-09-26 |
| 11735568 | Semiconductor die stacks and associated systems and methods | — | 2023-08-22 |
| 11735528 | Semiconductor memory stacks connected to processing units and associated systems and methods | — | 2023-08-22 |