Issued Patents All Time
Showing 26–50 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631644 | High density pillar interconnect conversion with stack to substrate connection | Owen R. Fay, Akshay N. Singh | 2023-04-18 |
| 11587912 | High density pillar interconnect conversion with stack to substrate connection | Owen R. Fay, Akshay N. Singh | 2023-02-21 |
| 11587895 | Semiconductor interconnect structures with vertically offset bonding surfaces, and associated systems and methods | — | 2023-02-21 |
| 11569203 | Multi-height interconnect structures and associated systems and methods | — | 2023-01-31 |
| 11532578 | 3DI solder cup | — | 2022-12-20 |
| 11527436 | Microelectronic devices with through-substrate interconnects and associated methods of manufacturing | Kunal R. Parekh, Sarah A. Niroumand | 2022-12-13 |
| 11289440 | Combination-bonded die pair packaging and associated systems and methods | Bret K. Street | 2022-03-29 |
| 11239207 | Semiconductor die stacks and associated systems and methods | — | 2022-02-01 |
| 11239169 | Semiconductor memory stacks connected to processing units and associated systems and methods | — | 2022-02-01 |
| 11195740 | Methods and apparatus for wafer handling and processing | Andrew M. Bayless | 2021-12-07 |
| 11177175 | Microelectronic devices and methods for filling vias in microelectronic devices | William M. Hiatt | 2021-11-16 |
| 11088114 | High density pillar interconnect conversion with stack to substrate connection | Owen R. Fay, Akshay N. Singh | 2021-08-10 |
| 11056443 | Apparatuses exhibiting enhanced stress resistance and planarity, and related methods | Chao Wang | 2021-07-06 |
| 11018056 | Encapsulated solder TSV insertion interconnect | Owen R. Fay | 2021-05-25 |
| 10998271 | High density pillar interconnect conversion with stack to substrate connection | Owen R. Fay, Akshay N. Singh | 2021-05-04 |
| 10978386 | Microelectronic devices with through-silicon vias and associated methods of manufacturing | Kunal R. Parekh, Philip J. Ireland, Sarah A. Niroumand | 2021-04-13 |
| 10964654 | 3DI solder cup | — | 2021-03-30 |
| 10943794 | Semiconductor device assembly with pillar array and test ability | Owen R. Fay, Akshay N. Singh | 2021-03-09 |
| 10872843 | Semiconductor devices with back-side coils for wireless signal and power coupling | — | 2020-12-22 |
| 10796989 | 3D interconnect multi-die inductors with through-substrate via cores | — | 2020-10-06 |
| 10784224 | Semiconductor devices with underfill control features, and associated systems and methods | Suresh Yeruva, Owen R. Fay, Sameer S. Vadhavkar | 2020-09-22 |
| 10741460 | Methods for forming interconnect assemblies with probed bond pads | Owen R. Fay, Luke England, Jaspreet S. Gandhi | 2020-08-11 |
| 10734272 | Semiconductor with through-substrate interconnect | Kunal R. Parekh | 2020-08-04 |
| 10685878 | Microelectronic devices with through-substrate interconnects and associated methods of manufacturing | Kunal R. Parekh, Sarah A. Niroumand | 2020-06-16 |
| 10600689 | Vias and conductive routing layers in semiconductor substrates | Sarah A. Niroumand | 2020-03-24 |