Issued Patents All Time
Showing 76–100 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9209158 | Pass-through 3D interconnect for microelectronic dies and associated systems and methods | David S. Pratt, Dewali Ray | 2015-12-08 |
| 9099457 | Semiconductor with through-substrate interconnect | Kunal R. Parekh | 2015-08-04 |
| 8929052 | Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto | Dewali Ray, Warren M. Farnworth | 2015-01-06 |
| 8907457 | Microelectronic devices with through-substrate interconnects and associated methods of manufacturing | Kunal R. Parekh, Sarah A. Niroumand | 2014-12-09 |
| 8859425 | Devices, systems, and methods related to forming through-substrate vias with sacrificial plugs | Kunal R. Parekh | 2014-10-14 |
| 8786097 | Method of forming vias in semiconductor substrates and resulting structures | Charles M. Watkins, Alan G. Wood, Salman Akram, Warren M. Farnworth | 2014-07-22 |
| 8772086 | Disabling electrical connections using pass-through 3D interconnects and associated systems and methods | Jeffery W. Janzen, Michael Chaine, William M. Hiatt | 2014-07-08 |
| 8753981 | Microelectronic devices with through-silicon vias and associated methods of manufacturing | Kunal R. Parekh, Philip J. Ireland, Sarah A. Niroumand | 2014-06-17 |
| 8748311 | Microelectronic devices and methods for filing vias in microelectronic devices | William M. Hiatt | 2014-06-10 |
| 8703518 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Salman Akram, William M. Hiatt | 2014-04-22 |
| 8679933 | Semiconductor device fabrication methods | Steve Oliver | 2014-03-25 |
| 8669179 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more | 2014-03-11 |
| 8629057 | Semiconductor substrates with unitary vias and via terminals, and associated systems and methods | Kunal R. Parekh | 2014-01-14 |
| 8531046 | Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside | Dave Pratt, Steve Oliver, Mark Hiatt | 2013-09-10 |
| 8503156 | Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto | Dewali Ray, Warren M. Farnworth | 2013-08-06 |
| 8502353 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more | 2013-08-06 |
| 8410612 | Interconnect regions | Philip J. Ireland | 2013-04-02 |
| 8404521 | Disabling electrical connections using pass-through 3D interconnects and associated systems and methods | Jeffery W. Janzen, Michael Chaine, William M. Hiatt | 2013-03-26 |
| 8404587 | Semiconductor with through-substrate interconnect | Kunal R. Parekh | 2013-03-26 |
| 8366852 | Method of forming temporary carrier structure and associated release techniques | — | 2013-02-05 |
| 8324100 | Methods of forming conductive vias | Salman Akram, William M. Hiatt, Steven Oliver, Alan G. Wood, Sidney B. Rigg +1 more | 2012-12-04 |
| 8294273 | Methods for fabricating and filling conductive vias and conductive vias so formed | Salman Akram, William M. Hiatt, Steve Oliver, Alan G. Wood, Sidney B. Rigg +1 more | 2012-10-23 |
| 8283785 | Interconnect regions | Philip J. Ireland | 2012-10-09 |
| 8253230 | Disabling electrical connections using pass-through 3D interconnects and associated systems and methods | Jeffery W. Janzen, Michael Chaine, William M. Hiatt | 2012-08-28 |
| 8110488 | Method for increasing etch rate during deep silicon dry etch | Swarnal Borthakur | 2012-02-07 |