Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11712844 | Lightweight structures having increased structural integrity and an ultra-low coefficient of thermal expansion | Tukaram K. Hatwar, Rebecca Borrelli | 2023-08-01 |
| 9966406 | Semiconductor devices including back-side integrated circuitry | Kyle K. Kirby | 2018-05-08 |
| 9484378 | Semiconductor devices including back-side integrated circuitry | Kyle K. Kirby | 2016-11-01 |
| 8982469 | Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same | David R. Hembree | 2015-03-17 |
| 8963292 | Semiconductor device having backside redistribution layers and method for fabricating the same | Warren M. Farnworth | 2015-02-24 |
| 8679933 | Semiconductor device fabrication methods | Kyle K. Kirby | 2014-03-25 |
| 8680634 | Method and apparatus providing an imager module with a permanent carrier | Swarnal Borthakur, Rick Lake, Andy Perkins, Scott Churchwell | 2014-03-25 |
| 8531046 | Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside | Dave Pratt, Kyle K. Kirby, Mark Hiatt | 2013-09-10 |
| 8395242 | Semiconductor device having backside redistribution layers | Warren M. Farnworth | 2013-03-12 |
| 8294273 | Methods for fabricating and filling conductive vias and conductive vias so formed | Salman Akram, William M. Hiatt, Alan G. Wood, Sidney B. Rigg, James M. Wark +1 more | 2012-10-23 |
| 8048708 | Method and apparatus providing an imager module with a permanent carrier | Swarnal Borthakur, Rick Lake, Andy Perkins, Scott Churchwell | 2011-11-01 |
| 8017982 | Imagers with contact plugs extending through the substrates thereof and imager fabrication methods | Kyle K. Kirby | 2011-09-13 |
| 7955946 | Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices | Dave Pratt, Kyle K. Kirby, Mark Hiatt | 2011-06-07 |
| 7932179 | Method for fabricating semiconductor device having backside redistribution layers | Warren M. Farnworth | 2011-04-26 |
| 7919230 | Thermal embossing of resist reflowed lenses to make aspheric lens master wafer | Shashikant Hegde, Jeff Viens | 2011-04-05 |
| 7920342 | Over-molded glass lenses and method of forming the same | Jacques Duparre | 2011-04-05 |
| 7916396 | Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same | David R. Hembree | 2011-03-29 |
| 7892972 | Methods for fabricating and filling conductive vias and conductive vias so formed | Salman Akram, William M. Hiatt, Alan G. Wood, Sidney B. Rigg, James M. Wark +1 more | 2011-02-22 |
| 7710667 | Imaging module with symmetrical lens system and method of manufacture | Rick Lake, Shashikant Hegde, Jeff Viens, Jacques Duparre | 2010-05-04 |
| 7626269 | Semiconductor constructions and assemblies, and electronic systems | Warren M. Farnworth | 2009-12-01 |