| 11712844 |
Lightweight structures having increased structural integrity and an ultra-low coefficient of thermal expansion |
Tukaram K. Hatwar, Rebecca Borrelli |
2023-08-01 |
| 9966406 |
Semiconductor devices including back-side integrated circuitry |
Kyle K. Kirby |
2018-05-08 |
| 9484378 |
Semiconductor devices including back-side integrated circuitry |
Kyle K. Kirby |
2016-11-01 |
| 8982469 |
Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same |
David R. Hembree |
2015-03-17 |
| 8963292 |
Semiconductor device having backside redistribution layers and method for fabricating the same |
Warren M. Farnworth |
2015-02-24 |
| 8679933 |
Semiconductor device fabrication methods |
Kyle K. Kirby |
2014-03-25 |
| 8680634 |
Method and apparatus providing an imager module with a permanent carrier |
Swarnal Borthakur, Rick Lake, Andy Perkins, Scott Churchwell |
2014-03-25 |
| 8531046 |
Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside |
Dave Pratt, Kyle K. Kirby, Mark Hiatt |
2013-09-10 |
| 8395242 |
Semiconductor device having backside redistribution layers |
Warren M. Farnworth |
2013-03-12 |
| 8294273 |
Methods for fabricating and filling conductive vias and conductive vias so formed |
Salman Akram, William M. Hiatt, Alan G. Wood, Sidney B. Rigg, James M. Wark +1 more |
2012-10-23 |
| 8048708 |
Method and apparatus providing an imager module with a permanent carrier |
Swarnal Borthakur, Rick Lake, Andy Perkins, Scott Churchwell |
2011-11-01 |
| 8017982 |
Imagers with contact plugs extending through the substrates thereof and imager fabrication methods |
Kyle K. Kirby |
2011-09-13 |
| 7955946 |
Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices |
Dave Pratt, Kyle K. Kirby, Mark Hiatt |
2011-06-07 |
| 7932179 |
Method for fabricating semiconductor device having backside redistribution layers |
Warren M. Farnworth |
2011-04-26 |
| 7919230 |
Thermal embossing of resist reflowed lenses to make aspheric lens master wafer |
Shashikant Hegde, Jeff Viens |
2011-04-05 |
| 7920342 |
Over-molded glass lenses and method of forming the same |
Jacques Duparre |
2011-04-05 |
| 7916396 |
Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same |
David R. Hembree |
2011-03-29 |
| 7892972 |
Methods for fabricating and filling conductive vias and conductive vias so formed |
Salman Akram, William M. Hiatt, Alan G. Wood, Sidney B. Rigg, James M. Wark +1 more |
2011-02-22 |
| 7710667 |
Imaging module with symmetrical lens system and method of manufacture |
Rick Lake, Shashikant Hegde, Jeff Viens, Jacques Duparre |
2010-05-04 |
| 7626269 |
Semiconductor constructions and assemblies, and electronic systems |
Warren M. Farnworth |
2009-12-01 |
