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Salman Akram — 726 Patents

Micron: 696 patents #4 of 6,374Top 1%

Koniniklijke Philips N.V.: 7 patents #1,078 of 7,486Top 15%

AIAptina Imaging: 6 patents #45 of 332Top 15%

LULumileds: 5 patents #102 of 528Top 20%

RRRound Rock Research: 4 patents #47 of 239Top 20%

FSFairchild Semiconductor: 2 patents #274 of 715Top 40%

MTMicorn Technology: 1 patents #1 of 8Top 15%

Boise, ID: #2 of 3,546 inventorsTop 1%

Idaho: #3 of 8,810 inventorsTop 1%

Overall (All Time): #152 of 4,157,543Top 1%

726 Patents All Time

Salman Akram has been granted 726 US patents while listed as an inventor at Micron. The first was granted in 1995 and the most recent in August 2023. Salman Akram ranks #152 of 4,157,543 US inventors in our database (top 0.00%). Patent records list Salman Akram in Boise, ID, US.

Patents per Year

Issued Patents All Time

Showing 1–25 of 726 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11721788	Method of bonding a semiconductor device to a support substrate	Quanbo Zou, Jerome Chandra Bhat	2023-08-08
11664396	Elevated pocket pixels, imaging devices and systems including the same and method of forming the same	—	2023-05-30	$12,815,000
11145794	Chip scale light emitting device package with dome	Jyoti Kiron Bhardwaj	2021-10-12
11127769	Elevated pocket pixels, imaging devices and systems including the same and method of forming the same	—	2021-09-21	$21,559,000
10741718	Laser de-bond carrier wafer from device wafer	Quanbo Zou, Jerome Chandra Bhat, Minh Ngoc Trieu, Robert G. Blank	2020-08-11
10504948	Elevated pocket pixels, imaging devices and systems including the same and method of forming the same	—	2019-12-10	$17,715,000
10490644	Hybrid gate dielectrics for semiconductor power devices	Venkat Ananthan	2019-11-26
10446440	Semiconductor devices comprising nickel— and copper—containing interconnects	James M. Wark, William M. Hiatt	2019-10-15	$10,153,000
10181486	Elevated pocket pixels, imaging devices and systems including the same and method of forming the same	—	2019-01-15	$44,869,000
10062608	Semiconductor devices comprising nickel- and copper-containing interconnects	James M. Wark, William M. Hiatt	2018-08-28	$23,018,000
10050180	LED with stress-buffer layer under metallization layer	Quanbo Zou	2018-08-14
10002941	Hybrid gate dielectrics for semiconductor power devices	Venkat Ananthan	2018-06-19
9960148	Methods for transferring heat from stacked microfeature devices	David R. Hembree	2018-05-01	$34,806,000
9935069	Reducing solder pad topology differences by planarization	Jipu Lei, Stefano Schiaffino, Alexander H. Nickel, Mooi Guan Ng	2018-04-03
9911769	Elevated pocket pixels, imaging devices and systems including the same and method of forming the same	—	2018-03-06	$28,626,000
9705047	Method of attaching a light emitting device to a support substrate	Daniel A. Steigerwald, Jerome Chandra Bhat	2017-07-11	$1,293,000
9660154	Chip scale light emitting device package with dome	Jyoti Kiron Bhardwaj	2017-05-23	$560,000
9640729	LED with stress-buffer layer under metallization layer	Quanbo Zou	2017-05-02	$1,117,000
9640433	Methods of forming interconnects and semiconductor structures	James M. Wark, William M. Hiatt	2017-05-02	$18,118,000
9437762	Elevated pocket pixels, imaging devices and systems including the same and method of forming the same	—	2016-09-06	$10,856,000
9431581	Method of attaching a light emitting device to a support substrate	Daniel A. Steigerwald, Jerome Chandra Bhat	2016-08-30	$454,000
9406857	Chip scale light emitting device with metal pillars in a molding compound formed at wafer level	Jipu Lei, Stefano Schiaffino, Alexander H. Nickel, Mooi Guan Ng, Grigoriy Basin	2016-08-02	$362,000
9343612	Method of bonding a semiconductor device to a support substrate	Quanbo Zou, Jerome Chanra Bhat	2016-05-17	$307,000
9153758	Method of attaching a light emitting device to a support substrate	Daniel A. Steigerwald, Jerome Chandra Bhat	2015-10-06	$630,000
8816405	Elevated pocket pixels, imaging devices and systems including the same and method of forming the same	—	2014-08-26	$14,612,000