Issued Patents All Time
Showing 1–25 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721788 | Method of bonding a semiconductor device to a support substrate | Quanbo Zou, Jerome Chandra Bhat | 2023-08-08 |
| 11664396 | Elevated pocket pixels, imaging devices and systems including the same and method of forming the same | — | 2023-05-30 |
| 11145794 | Chip scale light emitting device package with dome | Jyoti Kiron Bhardwaj | 2021-10-12 |
| 11127769 | Elevated pocket pixels, imaging devices and systems including the same and method of forming the same | — | 2021-09-21 |
| 10741718 | Laser de-bond carrier wafer from device wafer | Quanbo Zou, Jerome Chandra Bhat, Minh Ngoc Trieu, Robert G. Blank | 2020-08-11 |
| 10504948 | Elevated pocket pixels, imaging devices and systems including the same and method of forming the same | — | 2019-12-10 |
| 10490644 | Hybrid gate dielectrics for semiconductor power devices | Venkat Ananthan | 2019-11-26 |
| 10446440 | Semiconductor devices comprising nickel— and copper—containing interconnects | James M. Wark, William M. Hiatt | 2019-10-15 |
| 10181486 | Elevated pocket pixels, imaging devices and systems including the same and method of forming the same | — | 2019-01-15 |
| 10062608 | Semiconductor devices comprising nickel- and copper-containing interconnects | James M. Wark, William M. Hiatt | 2018-08-28 |
| 10050180 | LED with stress-buffer layer under metallization layer | Quanbo Zou | 2018-08-14 |
| 10002941 | Hybrid gate dielectrics for semiconductor power devices | Venkat Ananthan | 2018-06-19 |
| 9960148 | Methods for transferring heat from stacked microfeature devices | David R. Hembree | 2018-05-01 |
| 9935069 | Reducing solder pad topology differences by planarization | Jipu Lei, Stefano Schiaffino, Alexander H. Nickel, Mooi Guan Ng | 2018-04-03 |
| 9911769 | Elevated pocket pixels, imaging devices and systems including the same and method of forming the same | — | 2018-03-06 |
| 9705047 | Method of attaching a light emitting device to a support substrate | Daniel A. Steigerwald, Jerome Chandra Bhat | 2017-07-11 |
| 9660154 | Chip scale light emitting device package with dome | Jyoti Kiron Bhardwaj | 2017-05-23 |
| 9640729 | LED with stress-buffer layer under metallization layer | Quanbo Zou | 2017-05-02 |
| 9640433 | Methods of forming interconnects and semiconductor structures | James M. Wark, William M. Hiatt | 2017-05-02 |
| 9437762 | Elevated pocket pixels, imaging devices and systems including the same and method of forming the same | — | 2016-09-06 |
| 9431581 | Method of attaching a light emitting device to a support substrate | Daniel A. Steigerwald, Jerome Chandra Bhat | 2016-08-30 |
| 9406857 | Chip scale light emitting device with metal pillars in a molding compound formed at wafer level | Jipu Lei, Stefano Schiaffino, Alexander H. Nickel, Mooi Guan Ng, Grigoriy Basin | 2016-08-02 |
| 9343612 | Method of bonding a semiconductor device to a support substrate | Quanbo Zou, Jerome Chanra Bhat | 2016-05-17 |
| 9153758 | Method of attaching a light emitting device to a support substrate | Daniel A. Steigerwald, Jerome Chandra Bhat | 2015-10-06 |
| 8816405 | Elevated pocket pixels, imaging devices and systems including the same and method of forming the same | — | 2014-08-26 |